Intel Xeon Platinum 8354H

Xeon Platinum 8354H

AMD EPYC 7F52

EPYC 7F52

Intel Xeon Platinum 8354H vs AMD EPYC 7F52 Full Specs

18 Cores
36 Threads
3.1GHz
16 Cores
32 Threads
3.5GHz
TDP
205W
TDP
240W
Bandwidth
153.6GB/s
DDR4
Bandwidth
204.8GB/s
DDR4
Socket
Socket

Xeon Platinum 8354HXeon Platinum 8354H
x1.04
EPYC 7F52EPYC 7F52
x1

18 Cores
16 Cores
36 Threads
32 Threads

Base Clock
3.1GHz
Base Clock
3.5GHz
Boost Clock
4.3GHz
Boost Clock
3.9GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
512KB
L3
24.8MB
L3
256MB

Type
DDR4
Type
DDR4
Max Memory
1.28TB
Max Memory
4.1TB
ECC
Yes
ECC
Yes
Channels
6
Channels
8
Bus Width
384-bit
Bus Width
512-bit
Speed
3200MT/s
Speed
3200MT/s
Bandwidth
153.6GB/s
Bandwidth
204.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
153.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
204.8GB/s

TDP
205W
TDP
240W
Included Cooler
0
Included Cooler
-

Bus Type
UPI
Bus Type
PCIe
Bus Config
16-bit
Bus Config
8 lanes
Bus Speed
10.4GT/s
Bus Speed
16GT/s
Bus Bandwidth
20.8GB/s
Bus Bandwidth
16GB/s

PCIe
PCIe 3.0 x48
47.3GB/sBandwidth
PCIe
PCIe 4.0 x128
252GB/sBandwidth

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Xeon Platinum 2020 branding
Branding
EPYC 2017 branding
Codename
Cooper Lake-SP
-
Cooper Lake-SP-XCCVariant
Codename
Rome
Aspen HighlandsDie
Rome 8CCDVariant
Market Segment
Server
Market Segment
Server
Release Date
Jun 18, 2020
Release Date
Apr 14, 2020

Foundry
Intel
Foundry
TSMC
Other Foundries
-
Other Foundries
GlobalFoundriesIO
Fabrication Node
14nm+++
-
Fabrication Node
N7
12LPIO
Die Size
700mm²
-
Die Size
592mm²
416mm²IO
Transistor Count
12.3B
-
Transistor Count
30.4B
8.3BIO
Transistor Density
18 MTr/mm²
-
Transistor Density
51 MTr/mm²
20 MTr/mm²IO