CPUs

AMD EPYC 8124P vs Intel Xeon Silver 4310 Full Specs

16 Cores
32 Threads
2.45GHz
12 Cores
24 Threads
2.1GHz
TDP
125W
TDP
120W
Bandwidth
230.4GB/s
DDR5
Bandwidth
170.6GB/s
DDR4
Socket
Socket

16 Cores
12 Cores
32 Threads
24 Threads

Base Clock
2.45GHz
Base Clock
2.1GHz
Boost Clock
3GHz
Boost Clock
3.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
48KB
L2
1MB
L2
1.25MB
L3
64MB
L3
18MB

Type
DDR5
Type
DDR4
Max Memory
3.07TB
Max Memory
6.14TB
ECC
Yes
ECC
Yes
Channels
6
Channels
8
Bus Width
384-bit
Bus Width
512-bit
Speed
4800MT/s
Speed
2666MT/s
Bandwidth
230.4GB/s
Bandwidth
170.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
230.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
170.6GB/s

TDP
125W
TDP
120W
cTDP-down
120W
cTDP-down
-
cTDP-up
150W
cTDP-up
-
T-Case
-
T-Case
82°C Max
Included Cooler
-
Included Cooler
0

Bus Type
PCIe
Bus Type
UPI
Bus Config
8 lanes
Bus Config
20-bit
Bus Speed
32GT/s
Bus Speed
10.4GT/s
Bus Bandwidth
32GB/s
Bus Bandwidth
26GB/s

PCIe
PCIe 5.0 x96
378GB/sBandwidth
PCIe
PCIe 4.0 x64
126GB/sBandwidth

NPU Model
-
NPU Model
DL Boost

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
EPYC 2017 branding
Branding
Xeon Silver 2020 branding
Codename
Siena
VindhyaDie
Siena 1CCDVariant
-
Codename
Ice Lake-SP
-
Ice Lake-SP-LCCVariant
Sunny CoveP-Core
Market Segment
Server
Market Segment
Server
Release Date
Sep 18, 2023
Release Date
Apr 6, 2021

Foundry
TSMC
Foundry
Intel
Other Foundries
TSMCIO
Other Foundries
-
Fabrication Node
N5
N6IO
Fabrication Node
10nm+
-
Die Size
78mm²
388mm²IO
Die Size
360mm²
-
Transistor Count
7.5 Billion
11 BillionIO
Transistor Count
19.5 Billion
-
Transistor Density
96 MTr/mm²
28 MTr/mm²IO
Transistor Density
54 MTr/mm²
-