CPUs

Intel Xeon Silver 4310 vs AMD EPYC 8124P Full Specs

12 Cores
24 Threads
2.1GHz
16 Cores
32 Threads
2.45GHz
TDP
120W
TDP
125W
Bandwidth
170.6GB/s
DDR4
Bandwidth
230.4GB/s
DDR5
Socket
Socket

12 Cores
16 Cores
24 Threads
32 Threads

Base Clock
2.1GHz
Base Clock
2.45GHz
Boost Clock
3.3GHz
Boost Clock
3GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
48KB
L1d
32KB
L2
1.25MB
L2
1MB
L3
18MB
L3
64MB

Type
DDR4
Type
DDR5
Max Memory
6.14TB
Max Memory
3.07TB
ECC
Yes
ECC
Yes
Channels
8
Channels
6
Bus Width
512-bit
Bus Width
384-bit
Speed
2666MT/s
Speed
4800MT/s
Bandwidth
170.6GB/s
Bandwidth
230.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
170.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
230.4GB/s

TDP
120W
TDP
125W
cTDP-down
-
cTDP-down
120W
cTDP-up
-
cTDP-up
150W
T-Case
82°C Max
T-Case
-
Included Cooler
0
Included Cooler
-

Bus Type
UPI
Bus Type
PCIe
Bus Config
20-bit
Bus Config
8 lanes
Bus Speed
10.4GT/s
Bus Speed
32GT/s
Bus Bandwidth
26GB/s
Bus Bandwidth
32GB/s

PCIe
PCIe 4.0 x64
126GB/sBandwidth
PCIe
PCIe 5.0 x96
378GB/sBandwidth

NPU Model
DL Boost
NPU Model
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Xeon Silver 2020 branding
Branding
EPYC 2017 branding
Codename
Ice Lake-SP
-
Ice Lake-SP-LCCVariant
Sunny CoveP-Core
Codename
Siena
VindhyaDie
Siena 1CCDVariant
-
Market Segment
Server
Market Segment
Server
Release Date
Apr 6, 2021
Release Date
Sep 18, 2023

Foundry
Intel
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCIO
Fabrication Node
10nm+
-
Fabrication Node
N5
N6IO
Die Size
360mm²
-
Die Size
78mm²
388mm²IO
Transistor Count
19.5 Billion
-
Transistor Count
7.5 Billion
11 BillionIO
Transistor Density
54 MTr/mm²
-
Transistor Density
96 MTr/mm²
28 MTr/mm²IO