CPUs

AMD Phenom II N970 vs AMD Ryzen 3 210 Full Specs

4 Cores
4 Threads
2.2GHz
4 Cores(1P+3E)
8 Threads(2P+6E)
3GHz
TDP
35W
TDP
28W
Bandwidth
17.1GB/s
·
Bandwidth
120GB/s
·
iGPU
0
iGPU
··
-
··
2.56 TFLOPSFP16
Socket
Socket

Phenom II N970Phenom II N970188
x1
Ryzen 3 210Ryzen 3 2102,100
x11.17

4 Cores
4P
-
4 Cores
1P
3E
4 Threads
4P
-
8 Threads
2P
6E

Base Clock
2.2GHz
Base Clock
3GHz
Boost Clock
-
Boost Clock
4.7GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
L1i
32KB P
L1d
64KB P
L1d
32KB P
L2
512KB P
L2
1MB P
L3
-
L3
8MB

Type
·
Type
·
Max Memory
32GB
Max Memory
256GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
1066MT/s
Speed
7500MT/s
Bandwidth
17.1GB/s
Bandwidth
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s

TDP
35W
TDP
28W
cTDP-down
-
cTDP-down
15W
cTDP-up
-
cTDP-up
30W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
HT
Bus Type
PCIe
Bus Config
16-bit
Bus Config
4 lanes
Bus Speed
3.6GT/s
Bus Speed
16GT/s
Bus Bandwidth
7.2GB/s
Bus Bandwidth
8GB/s

-
PCIe
PCIe 4.0 x14
27.6GB/sBandwidth

iGPU
0
iGPU
Shaders
-
Shaders
256
Boost Clock
-
Boost Clock
2.5GHz
··
-
··
2.56 TFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Phenom II 2009 branding
Branding
Ryzen 3 2024 branding
Codename
Champlain
-
-
-
Codename
Hawk Point
Hawk Point SVariant
Zen 4P-Core
Zen 4cE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 4, 2011
Release Date
Jan 6, 2025

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
45nm
Fabrication Node
N4
Die Size
117mm²
Die Size
137mm²
Transistor Count
234 Million
Transistor Count
20.9 Billion
Transistor Density
2 MTr/mm²
Transistor Density
153 MTr/mm²

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