AMD Ryzen 3 210 vs Intel N100 Full Specs

Summary

4 Cores(1P+3E) 8 Threads(2P+6E) 3GHz	4 Cores 4 Threads 800MHz
TDP 28W	TDP 6W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 38.4GB/s LPDDR5·DDR5·DDR4
iGPU Radeon 740M 2500MHz	iGPU UHD 24EU 750MHz Gen 12
Peak·FP32·FP16 2.56 TFLOPSFP16	Peak·FP32·FP16 576 GFLOPSFP16
Socket FP8	Socket BGA 1264

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 2102,100

x1.88

N1001,118

x1

Show Top Score

Core Config

4 Cores 1P 3E	4 Cores 4P -
8 Threads 2P 6E	4 Threads 4P -

Clocks

Base Clock 3GHz	Base Clock 800MHz
Boost Clock 4.7GHz	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 64KB P
L1d 32KB P	L1d 32KB P
L2 1MB P -	L2 2MB P shared
L3 8MB	L3 6MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5·DDR5·DDR4
Max Memory 256GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 64-bit
Speed 7500MT/s	Speed 4800MT/s
Bandwidth 120GB/s	Bandwidth 38.4GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate4800MT/s Calculated Bandwidth 38.4GB/s

Power & Thermals

TDP 28W	TDP 6W
cTDP-down 15W	cTDP-down -
cTDP-up 30W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 105°C Max

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

PCIe PCIe 3.0 x9 8.9GB/sBandwidth

iGPU

iGPU Radeon 740M 2500MHz	iGPU UHD 24EU 750MHz Gen 12
Shaders 256	Shaders 192
Boost Clock 2.5GHz	Boost Clock 750MHz
Peak·FP32·FP16 2.56 TFLOPSFP16	Peak·FP32·FP16 576 GFLOPSFP16

NPU

NPU Model -

NPU Model GNA 3.0

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Gracemont
Family Ryzen 200	Family Processor
Branding	Branding
Codename Hawk Point Hawk Point SVariant Zen 4P-Core Zen 4cE-Core	Codename Alder Lake-N Alder Lake-8EVariant GracemontP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 3, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4	Fabrication Node Intel 7
Die Size 137mm²	Die Size 122mm²
Transistor Count 20.9 Billion	Transistor Count 8.5 Billion
Transistor Density 153 MTr/mm²	Transistor Density 70 MTr/mm²

Images

No images available

No images available

Used In

Laptops -

Laptops Inspiron 15(3530, Early 2023)

Competitors

AMDRyzen 3 210 vs CPU AMDRyzen 3 PRO 210 AMDRyzen 3 210 vs CPU AMDRyzen 5 PRO 230 AMDRyzen 3 210 vs CPU AMDRyzen 5 240 Show 12 more

IntelN100 vs CPU AMDRyzen 3 PRO 210 IntelN100 vs CPU AMDRyzen 5 PRO 230 IntelN100 vs CPU AMDRyzen 5 230 Show 11 more