AMD Ryzen 3 PRO 210 vs Intel Core i5-7267U Full Specs

Summary

4 Cores(1P+3E) 8 Threads(2P+6E) 3GHz	2 Cores 4 Threads 3.1GHz
TDP 28W	TDP 28W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 34.1GB/s DDR4·LPDDR3·DDR3L
iGPU Radeon 740M 2500MHz	iGPU Iris Plus 650 1050MHz
Peak·FP32·FP16 2.56 TFLOPSFP16	Peak·FP32·FP16 806.4 GFLOPSFP16
Socket FP8	Socket BGA 1356

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 PRO 2102,100

x1.85

Core i5-7267U1,137

x1

Show Top Score

Core Config

4 Cores 1P 3E	2 Cores 2P -
8 Threads 2P 6E	4 Threads 4P -

Clocks

Base Clock 3GHz	Base Clock 3.1GHz
Boost Clock 4.7GHz	Boost Clock 3.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 1MB P	L2 256KB P
L3 8MB	L3 4MB
L4 Cache -	L4 Cache 64MB

Memory

Type LPDDR5X·DDR5	Type DDR4·LPDDR3·DDR3L
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 7500MT/s	Speed 2133MT/s
Bandwidth 120GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate2133MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 28W	TDP 28W
cTDP-down 15W	cTDP-down 23W
cTDP-up 30W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 4.0 x14 27.6GB/sBandwidth

PCIe PCIe 3.0 x12 11.8GB/sBandwidth

iGPU

iGPU Radeon 740M 2500MHz	iGPU Iris Plus 650 1050MHz
Shaders 256	Shaders 384
Boost Clock 2.5GHz	Boost Clock 1.05GHz
Peak·FP32·FP16 2.56 TFLOPSFP16	Peak·FP32·FP16 806.4 GFLOPSFP16

Controller

Controller Model -	Controller Model 200 Series U+
Codename -	Codename Kaby Lake
PCIe -	PCIe -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Skylake
Family Ryzen 200	Family Core 7th Gen
Branding	Branding
Codename Hawk Point Hawk Point SVariant Zen 4P-Core Zen 4cE-Core	Codename Kaby Lake-U Kaby Lake-2C-GT3Variant - -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 3, 2017

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries InteleDRAM IntelPCH
Fabrication Node N4 - -	Fabrication Node 14nm+ 22nmeDRAM 22nmPCH
Die Size 137mm² - -	Die Size 148mm² 42mm²eDRAM 50mm²PCH
Transistor Count 20.9 Billion	Transistor Count 2.5 Billion
Transistor Density 153 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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Used In

Laptops -

Laptops MacBook Pro 13(Four Ports, Mid 2017)

Competitors

AMDRyzen 3 PRO 210 vs CPU AMDRyzen 3 210 AMDRyzen 3 PRO 210 vs CPU AMDRyzen 5 PRO 220 AMDRyzen 3 PRO 210 vs CPU AMDRyzen 5 230 Show 12 more

IntelCore i5-7267U vs CPU AMDRyzen 3 210 IntelCore i5-7267U vs CPU AMDRyzen 9 270 IntelCore i5-7267U vs CPU AMDRyzen 7 260 Show 12 more