CPUs

AMD Ryzen 5 220 vs Intel Mobile Pentium III 650 Full Specs

6 Cores(2P+4E)
12 Threads(4P+8E)
3.2GHz
1 Cores
1 Threads
650MHz
TDP
28W
TDP
21.5W
Bandwidth
120GB/s
·
Bandwidth
-
iGPU
iGPU
-
··
2.87 TFLOPSFP16
··
-
Socket
Socket

Ryzen 5 220Ryzen 5 2202,250
x1
Mobile Pentium III 650Mobile Pentium III 650-
-

6 Cores
2P
4E
1 Cores
1P
-
12 Threads
4P
8E
1 Threads
1P
-

Base Clock
3.2GHz
Base Clock
650MHz
Boost Clock
4.9GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
L1i
16KB P
L1d
32KB P
L1d
16KB P
L2
1MB P
L2
256KB P
L3
16MB
L3
-

Type
·
Type
-
Max Memory
256GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
7500MT/s
Speed
-
Bandwidth
120GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
-

TDP
28W
TDP
21.5W
cTDP-down
15W
cTDP-down
-
cTDP-up
30W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
-
Voltage Range
-
Voltage Range
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
100MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
0.8GB/s

PCIe
PCIe 4.0 x14
27.6GB/sBandwidth
-

iGPU
iGPU
-
Shaders
256
Shaders
-
Boost Clock
2.8GHz
Boost Clock
-
··
2.87 TFLOPSFP16
··
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-32
Architecture
Architecture
Family
Family
Branding
Ryzen 5 2024 branding
Branding
Pentium III M 1999 branding
Codename
Hawk Point
Hawk Point SVariant
Zen 4P-Core
Zen 4cE-Core
Codename
Coppermine
-
-
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Jan 18, 2000

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
180nm
Die Size
137mm²
Die Size
105mm²
Transistor Count
20.9 Billion
Transistor Count
28 Million
Transistor Density
153 MTr/mm²
Transistor Density
-

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