CPUs

AMD Ryzen 5 240 vs Intel Core 2 Duo T7300 Full Specs

6 Cores
12 Threads
4.3GHz
2 Cores
2 Threads
2GHz
TDP
45W
TDP
35W
Bandwidth
120GB/s
·
Bandwidth
-
iGPU
iGPU
-
··
3.99 TFLOPSFP16
··
-
Socket
Socket

Ryzen 5 240Ryzen 5 2402,350
x9.87
Core 2 Duo T7300Core 2 Duo T7300238
x1

6 Cores
2 Cores
12 Threads
2 Threads

Base Clock
4.3GHz
Base Clock
2GHz
Boost Clock
5GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
4MB shared
L3
16MB
L3
-

Type
·
Type
-
Max Memory
256GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
7500MT/s
Speed
-
Bandwidth
120GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
-

TDP
45W
TDP
35W
cTDP-down
35W
cTDP-down
-
cTDP-up
54W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max
Voltage Range
-
Voltage Range
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
800MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
6.4GB/s

PCIe
PCIe 4.0 x20
39.4GB/sBandwidth
-

iGPU
iGPU
-
Shaders
384
Shaders
-
Boost Clock
2.6GHz
Boost Clock
-
··
3.99 TFLOPSFP16
··
-

NPU Model
XDNA
NPU Model
-
Performance
16 TOPSINT4
Performance
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 5 2024 branding
Branding
Core 2 Duo 2006 branding
Codename
Hawk Point
Codename
Merom
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
May 1, 2007

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
65nm
Die Size
178mm²
Die Size
143mm²
Transistor Count
25 Billion
Transistor Count
291 Million
Transistor Density
140 MTr/mm²
Transistor Density
2 MTr/mm²

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