CPUs

AMD Ryzen 5 5605GE vs Intel Pentium 2030M Full Specs

6 Cores
12 Threads
3.4GHz
2 Cores
2 Threads
2.5GHz
TDP
35W
TDP
35W
Bandwidth
51.2GB/s
DDR4
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
3.4 TFLOPSFP16
··
176 GFLOPSFP32
Socket
Socket

Ryzen 5 5605GERyzen 5 5605GE1,957
x4.57
Pentium 2030MPentium 2030M428
x1

6 Cores
2 Cores
12 Threads
2 Threads

Base Clock
3.4GHz
Base Clock
2.5GHz
Boost Clock
4.4GHz
Boost Clock
-
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
512KB
L2
256KB
L3
16MB
L3
2MB

Type
DDR4
Type
·
Max Memory
64GB
Max Memory
32GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
3200MT/s
Speed
1600MT/s
Bandwidth
51.2GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
35W
TDP
35W
Max Operating Temp
95°C Max
Max Operating Temp
90°C Max

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
8GT/s
Bus Speed
5GT/s
Bus Bandwidth
4GB/s
Bus Bandwidth
2.5GB/s

PCIe
PCIe 3.0 x20
19.7GB/sBandwidth
PCIe
PCIe 2.0 x16
8GB/sBandwidth

iGPU
iGPU
Shaders
448
Shaders
80
Boost Clock
1.9GHz
Boost Clock
1.1GHz
··
3.4 TFLOPSFP16
··
176 GFLOPSFP32

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 5 2017 branding
Branding
Pentium 2013 branding
Codename
Cezanne
-
-
Codename
Gladden
Ivy Bridge-M-2Die
Ivy Bridge-2C-GT1Variant
Market Segment
Desktop
Market Segment
Laptop
Release Date
Feb 26, 2025
Release Date
Jan 1, 2013

Foundry
TSMC
Foundry
Intel
Fabrication Node
N7
Fabrication Node
22nm
Die Size
180mm²
Die Size
94mm²
Transistor Count
10.7 Billion
Transistor Count
750 Million
Transistor Density
59 MTr/mm²
Transistor Density
8 MTr/mm²

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