AMD Ryzen 5 6600HS vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs

Summary

6 Cores 12 Threads 3.3GHz	10 Cores 10 Threads 3.4GHz
TDP 35W	TDP 23W
Bandwidth 204.8GB/s LPDDR5·DDR5	Bandwidth 135.2GB/s LPDDR5X
iGPU Radeon 660M 1900MHz	iGPU Adreno X1 3.8T
Peak·FP32·FP16 2.92 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket FP7	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 5 6600HS1,883

x1

Snapdragon X Plus (X1P-64-100)2,349

x1.25

Show Top Score

Core Config

6 Cores	10 Cores
12 Threads	10 Threads

Clocks

Base Clock 3.3GHz	Base Clock 3.4GHz
Boost Clock 4.5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 192KB
L1d 32KB	L1d 96KB
L2 512KB	L2 36MB shared
L3 32MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5·DDR5	Type LPDDR5X
Max Memory 64GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 8448MT/s
Bandwidth 204.8GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 35W	TDP 23W
Max Operating Temp 95°C Max	Max Operating Temp -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 8GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Radeon 660M 1900MHz	iGPU Adreno X1 3.8T
Shaders 384	Shaders 1536
Boost Clock 1.9GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 2.92 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 3+	Architecture OryonARMv8.7-A
Family Ryzen 6000	Family X Series
Branding	Branding
Codename Rembrandt - -	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 4, 2022	Release Date Apr 24, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N4P
Die Size 210mm²	Die Size 170mm²
Transistor Count 13.1 Billion	Transistor Count -
Transistor Density 62 MTr/mm²	Transistor Density -

Images

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Used In

Laptops IdeaPad 5 Pro 14(Gen 7, Mid 2022)IdeaPad 5 Pro 16(Gen 7, Mid 2022)	Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more
Tablets -	Tablets Surface Pro 11(X Elite, Mid 2024)

Competitors

AMDRyzen 5 6600HS vs CPU AMDRyzen 5 230 AMDRyzen 5 6600HS vs CPU AMDRyzen 5 PRO 220 AMDRyzen 5 6600HS vs CPU AMDRyzen 5 240 Show 12 more

QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 350 Show 12 more