CPUs

AMD Ryzen 7 PRO 250 vs Intel Celeron 530 Full Specs

8 Cores
16 Threads
3.3GHz
1 Cores
1 Threads
1.73GHz
TDP
28W
TDP
27W
Bandwidth
120GB/s
·
Bandwidth
-
iGPU
iGPU
0
··
8.29 TFLOPSFP16
··
-
Socket
Socket

Ryzen 7 PRO 250Ryzen 7 PRO 2502,300
x11.79
Celeron 530Celeron 530195
x1

8 Cores
1 Cores
16 Threads
1 Threads

Base Clock
3.3GHz
Base Clock
1.73GHz
Boost Clock
5.1GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
1MB shared
L3
16MB
L3
-

Type
·
Type
-
Max Memory
256GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
7500MT/s
Speed
-
Bandwidth
120GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
-

TDP
28W
TDP
27W
cTDP-down
15W
cTDP-down
-
cTDP-up
30W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max
Voltage Range
-
Voltage Range
-

Bus Type
PCIe
Bus Type
FSB
Bus Config
4 lanes
Bus Config
64-bit
Bus Speed
16GT/s
Bus Speed
533MT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
4.3GB/s

PCIe
PCIe 4.0 x20
39.4GB/sBandwidth
-

iGPU
iGPU
0
Shaders
768
Shaders
-
Boost Clock
2.7GHz
Boost Clock
-
··
8.29 TFLOPSFP16
··
-

NPU Model
XDNA
NPU Model
-
Performance
16 TOPSINT4
Performance
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 7 2024 branding
Branding
Celeron 2006 branding
Codename
Hawk Point
Codename
Merom-L
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Mar 1, 2007

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
65nm
Die Size
178mm²
Die Size
77mm²
Transistor Count
25 Billion
Transistor Count
105 Million
Transistor Density
140 MTr/mm²
Transistor Density
1 MTr/mm²

No images available
No images available