AMD Ryzen 7 PRO 250 vs Intel Celeron B830 Full Specs

Summary

8 Cores 16 Threads 3.3GHz	2 Cores 2 Threads 1.8GHz
TDP 28W	TDP 35W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 21.3GB/s DDR3
iGPU Radeon 780M 2700MHz	iGPU HD 1050MHz Gen 6
Peak·FP32·FP16 8.29 TFLOPSFP16	Peak·FP32·FP16 100.8 GFLOPSFP32
Socket FP8	Socket PGA 988

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 7 PRO 2502,300

x7.85

Celeron B830293

x1

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Core Config

8 Cores	2 Cores
16 Threads	2 Threads

Clocks

Base Clock 3.3GHz	Base Clock 1.8GHz
Boost Clock 5.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 1MB	L2 256KB
L3 16MB	L3 2MB

Memory

Type LPDDR5X·DDR5	Type DDR3
Max Memory 256GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 7500MT/s	Speed 1333MT/s
Bandwidth 120GB/s	Bandwidth 21.3GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 120GB/s	Bandwidth Calculator Channels Transfer Rate1333MT/s Calculated Bandwidth 21.3GB/s

Power & Thermals

TDP 28W	TDP 35W
cTDP-down 15W	cTDP-down -
cTDP-up 30W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 5GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2.5GB/s

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

PCIe PCIe 2.0 x16 8GB/sBandwidth

iGPU

iGPU Radeon 780M 2700MHz	iGPU HD 1050MHz Gen 6
Shaders 768	Shaders 48
Boost Clock 2.7GHz	Boost Clock 1.05GHz
Peak·FP32·FP16 8.29 TFLOPSFP16	Peak·FP32·FP16 100.8 GFLOPSFP32

NPU

NPU Model XDNA	NPU Model -
Performance 16 TOPSINT4	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 4	Architecture Sandy Bridge
Family Ryzen 200	Family Celeron
Branding	Branding
Codename Hawk Point - -	Codename Gladden Sandy Bridge-M-2Die Sandy Bridge-2C-GT1Variant
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 1, 2012

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4	Fabrication Node 32nm
Die Size 178mm²	Die Size 131mm²
Transistor Count 25 Billion	Transistor Count 504 Million
Transistor Density 140 MTr/mm²	Transistor Density 4 MTr/mm²

Images

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Competitors

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