CPUs

AMD Ryzen 7 PRO 250 vs Intel Core i3-380UM Full Specs

8 Cores
16 Threads
3.3GHz
2 Cores
4 Threads
1.33GHz
TDP
28W
TDP
18W
Bandwidth
120GB/s
·
Bandwidth
12.8GB/s
DDR3
iGPU
iGPU
··
8.29 TFLOPSFP16
··
96 GFLOPSFP32
Socket
Socket

Ryzen 7 PRO 250Ryzen 7 PRO 2502,300
x11.50
Core i3-380UMCore i3-380UM200
x1

8 Cores
2 Cores
16 Threads
4 Threads

Base Clock
3.3GHz
Base Clock
1.33GHz
Boost Clock
5.1GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
256KB
L3
16MB
L3
3MB

Type
·
Type
DDR3
Max Memory
256GB
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
7500MT/s
Speed
800MT/s
Bandwidth
120GB/s
Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
12.8GB/s

TDP
28W
TDP
18W
cTDP-down
15W
cTDP-down
-
cTDP-up
30W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
105°C Max
Voltage Range
-
Voltage Range
-

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
16GT/s
Bus Speed
2.5GT/s
Bus Bandwidth
8GB/s
Bus Bandwidth
1.3GB/s

PCIe
PCIe 4.0 x20
39.4GB/sBandwidth
PCIe
PCIe 2.0 x16
8GB/sBandwidth

iGPU
iGPU
Shaders
768
Shaders
96
Boost Clock
2.7GHz
Boost Clock
500MHz
··
8.29 TFLOPSFP16
··
96 GFLOPSFP32

NPU Model
XDNA
NPU Model
-
Performance
16 TOPSINT4
Performance
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 7 2024 branding
Branding
Core i3 2009 branding
Codename
Hawk Point
Codename
Arrandale
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Oct 1, 2010

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
InteliGPU
Fabrication Node
N4
-
Fabrication Node
32nm
45nmiGPU
Die Size
178mm²
-
Die Size
81mm²
114mm²iGPU
Transistor Count
25 Billion
-
Transistor Count
382 Million
177 MillioniGPU
Transistor Density
140 MTr/mm²
-
Transistor Density
5 MTr/mm²
2 MTr/mm²iGPU

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