AMD Ryzen 9 3900 vs Intel Core i3-3210 Full Specs

Summary

12 Cores 24 Threads 3.1GHz	2 Cores 4 Threads 3.2GHz
TDP 65W	TDP 55W
Bandwidth 51.2GB/s DDR4	Bandwidth 25.6GB/s DDR3
iGPU 0	iGPU HD 2500 1050MHz
Peak·FP32·FP16 -	Peak·FP32·FP16 100.8 GFLOPSFP32
Socket AM4	Socket LGA 1155

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 TDP

Ryzen 9 39001,677

x3.06

Core i3-3210548

x1

Show Top Score

Core Config

12 Cores	2 Cores
24 Threads	4 Threads

Clocks

Base Clock 3.1GHz	Base Clock 3.2GHz
Boost Clock 4.3GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 512KB	L2 256KB
L3 64MB	L3 3MB

Memory

Type DDR4	Type DDR3
Max Memory 128GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 3200MT/s	Speed 1600MT/s
Bandwidth 51.2GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 65W	TDP 55W
Max Operating Temp 95°C Max	Max Operating Temp -
T-Case -	T-Case 65.3°C Max
Included Cooler -	Included Cooler 1

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 5GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2.5GB/s

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

PCIe PCIe 2.0 x16 8GB/sBandwidth

iGPU

iGPU 0	iGPU HD 2500 1050MHz
Shaders -	Shaders 48
Boost Clock -	Boost Clock 1.05GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 100.8 GFLOPSFP32

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 2	Architecture Ivy Bridge
Family Ryzen 3000	Family Core 3rd Gen
Branding	Branding
Codename Matisse Aspen HighlandsDie Matisse 2CCDVariant	Codename Gladden Ivy Bridge-M-2Die Ivy Bridge-2C-GT1Variant
Market Segment Desktop	Market Segment Desktop
Release Date Oct 8, 2019	Release Date Jan 1, 2013

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries GlobalFoundriesIO	Other Foundries -
Fabrication Node N7 12LPIO	Fabrication Node 22nm -
Die Size 148mm² 125mm²IO	Die Size 94mm² -
Transistor Count 7.6 Billion 2.1 BillionIO	Transistor Count 750 Million -
Transistor Density 51 MTr/mm² 17 MTr/mm²IO	Transistor Density 8 MTr/mm² -

Images

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Competitors

AMDRyzen 9 3900 vs CPU AMDRyzen 7 5705G AMDRyzen 9 3900 vs CPU AMDRyzen 7 5705GE AMDRyzen 9 3900 vs CPU AMDRyzen 3 5305G Show 12 more

IntelCore i3-3210 vs CPU AMDRyzen 3 5305G IntelCore i3-3210 vs CPU AMDRyzen 7 5705GE IntelCore i3-3210 vs CPU AMDRyzen 7 5705G Show 12 more