CPUs

AMD Ryzen 9 7945HX3D vs Intel Core i3-7100H Full Specs

16 Cores
32 Threads
2.5GHz
2 Cores
4 Threads
3GHz
TDP
55W
TDP
35W
Bandwidth
83.2GB/s
DDR5
Bandwidth
38.4GB/s
··
iGPU
iGPU
··
1.13 TFLOPSFP16
··
364.8 GFLOPSFP16
Socket
Socket

16 Cores
2 Cores
32 Threads
4 Threads

Base Clock
2.5GHz
Base Clock
3GHz
Boost Clock
5.4GHz
Boost Clock
-
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
256KB
L3
192MB(V-Cache)
L3
3MB

Type
DDR5
Type
··
Max Memory
64GB
Max Memory
64GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
5200MT/s
Speed
2400MT/s
Bandwidth
83.2GB/s
Bandwidth
38.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
38.4GB/s

TDP
55W
TDP
35W
cTDP-down
45W
cTDP-down
-
cTDP-up
75W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max

Bus Type
PCIe
Bus Type
DMI
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
32GT/s
Bus Speed
8GT/s
Bus Bandwidth
16GB/s
Bus Bandwidth
4GB/s

PCIe
PCIe 5.0 x28
110.3GB/sBandwidth
PCIe
PCIe 3.0 x16
15.8GB/sBandwidth

iGPU
iGPU
Shaders
128
Shaders
192
Boost Clock
2.2GHz
Boost Clock
950MHz
··
1.13 TFLOPSFP16
··
364.8 GFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Ryzen 9 2023 branding
Branding
Core i3 2016 branding
Codename
Dragon Range
DurangoDie
Dragon Range 2CCD 3DVariant
Codename
Kaby Lake-H
-
Kaby Lake-2C-GT2Variant
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jul 27, 2023
Release Date
Jan 3, 2017

Foundry
TSMC
Foundry
Intel
Other Foundries
TSMCIO
Other Foundries
-
Fabrication Node
N5
N6IO
Fabrication Node
14nm+
-
Die Size
142mm²
122mm²IO
Die Size
103mm²
-
Transistor Count
13.1 Billion
3.4 BillionIO
Transistor Count
1.8 Billion
-
Transistor Density
93 MTr/mm²
28 MTr/mm²IO
Transistor Density
17 MTr/mm²
-