AMD Ryzen 9 8945HS vs Apple M6 (12C12G) Full Specs

Summary

8 Cores 16 Threads 4GHz	12 Cores(2P+4M+6E) 12 Threads(2P+4M+6E) 4.79GHz
TDP 45W	TDP 30W
Bandwidth 120GB/s LPDDR5X·DDR5	Bandwidth 170.7GB/s LPDDR5X
iGPU Radeon 780M 2800MHz	iGPU 12-Core M6
Peak·FP32·FP16 17.2 TOPSINT8 Tensor	Peak·FP32·FP16 42.64 TOPSINT8 Tensor
Socket FP7	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen 9 8945HS2,517

x1

M6 (12C12G)4,713

x1.87

Show Top Score

Core Config

8 Cores 8P - -	12 Cores 2P 4M 6E
16 Threads 16P - -	12 Threads 2P 4M 6E

Clocks

Base Clock 4GHz	Base Clock 4.79GHz
Boost Clock 5.2GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 192KB P 128KB M 160KB E
L1d 32KB P - -	L1d 128KB P 64KB M 96KB E
L2 1MB P - -	L2 1.5MB P 20MB P shared 8MB E shared
L3 16MB	L3 -
SLC Cache -	SLC Cache 16MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 7500MT/s	Speed 10667MT/s
Bandwidth 120GB/s	Bandwidth 170.7GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s UC·Spec·OC 120GB/s	Bandwidth Calculator Channels Transfer Rate10667MT/s UC·Spec·OC 170.7GB/s

Power & Thermals

TDP 45W	TDP 30W
cTDP-down 35W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Radeon 780M 2800MHz	iGPU 12-Core M6
Shaders 768	Shaders 1536
Boost Clock 2.8GHz	Boost Clock 1.74GHz
Peak·FP32·FP16 17.2 TOPSINT8 Tensor	Peak·FP32·FP16 42.64 TOPSINT8 Tensor

NPU

NPU Model XDNA	NPU Model H18 Kirkland
NPU Cores -	NPU Cores 32
NPU Clock -	NPU Clock 2.58GHz
Performance 16 TOPSINT4	Performance 84 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 4	Architecture Apple Silicon 16ARMv9.3-A
Family Ryzen 8000	Family M Series
Branding	Branding
Codename Hawk Point - - - -	Codename Komodo M6Variant AS16PP-Core AS16MM-Core AS16EE-Core
Market Segment Laptop	Market Segment Desktop
Release Date Dec 6, 2023	Release Date Aug 25, 2026
Part Number 100-000001319, 100-000001309	Part Number APL1301, T8152
Official specs	Official specs

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4	Fabrication Node N2
Die Size 178mm²	Die Size -
Transistor Count 25B	Transistor Count -
Transistor Density 140 MTr/mm²	Transistor Density -

Images