AMD Ryzen 9 PRO 3900 vs Intel Core i9-10900 Full Specs

Summary

12 Cores 24 Threads 3.1GHz	10 Cores 20 Threads 2.8GHz
TDP 65W	TDP 65W
Bandwidth 51.2GB/s DDR4	Bandwidth 46.9GB/s DDR4
iGPU 0	iGPU UHD 630 1200MHz
Peak·FP32·FP16 -	Peak·FP32·FP16 460.8 GFLOPSFP16
Socket AM4	Socket LGA 1200

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 9 PRO 39001,715

x1

Core i9-109001,802

x1.05

Show Top Score

Core Config

12 Cores	10 Cores
24 Threads	20 Threads

Clocks

Base Clock 3.1GHz	Base Clock 2.8GHz
Boost Clock 4.3GHz	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 512KB	L2 256KB
L3 64MB	L3 20MB

Memory

Type DDR4	Type DDR4
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 3200MT/s	Speed 2933MT/s
Bandwidth 51.2GB/s	Bandwidth 46.9GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s

Power & Thermals

TDP 65W	TDP 65W
Max Operating Temp 95°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 1

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 8GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU 0	iGPU UHD 630 1200MHz
Shaders -	Shaders 192
Boost Clock -	Boost Clock 1.2GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 460.8 GFLOPSFP16

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 2	Architecture Skylake
Family Ryzen 3000	Family Core 10th Gen
Branding	Branding
Codename Matisse Aspen HighlandsDie Matisse 2CCDVariant	Codename Comet Lake-S - Comet Lake-10CVariant
Market Segment Desktop	Market Segment Desktop
Release Date Sep 30, 2019	Release Date Apr 30, 2020

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries GlobalFoundriesIO	Other Foundries -
Fabrication Node N7 12LPIO	Fabrication Node 14nm+++ -
Die Size 148mm² 125mm²IO	Die Size 198mm² -
Transistor Count 7.6 Billion 2.1 BillionIO	Transistor Count 3.4 Billion -
Transistor Density 51 MTr/mm² 17 MTr/mm²IO	Transistor Density 17 MTr/mm² -

Images

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Used In

All-in-Ones -

All-in-Ones Envy 32(Early 2020)

Competitors

AMDRyzen 9 PRO 3900 vs CPU AMDRyzen 7 5705G AMDRyzen 9 PRO 3900 vs CPU AMDRyzen 7 5705GE AMDRyzen 9 PRO 3900 vs CPU AMDRyzen 3 5305G Show 12 more

IntelCore i9-10900 vs CPU AMDRyzen 7 9700X IntelCore i9-10900 vs CPU AMDRyzen 7 9800X3D IntelCore i9-10900 vs CPU AMDRyzen 9 9900X Show 12 more