AMD Ryzen AI 5 340 vs Intel Celeron N3150 Full Specs

Summary

6 Cores(3P+3E) 12 Threads(6P+6E) 2GHz	4 Cores 4 Threads 1.6GHz
TDP 28W	TDP 6W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 25.6GB/s DDR3L
iGPU Radeon 840M 2900MHz	iGPU HD 640MHz 12EU Gen 8
Peak·FP32·FP16 2.97 TFLOPSFP16	Peak·FP32·FP16 245.8 GFLOPSFP16
Socket FP8	Socket BGA 1170

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 5 340-

-

Celeron N3150168

x1

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Core Config

6 Cores 3P 3E	4 Cores 4P -
12 Threads 6P 6E	4 Threads 4P -

Clocks

Base Clock 2GHz	Base Clock 1.6GHz
Boost Clock 4.8GHz	Boost Clock 2.08GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 24KB P
L2 1MB P -	L2 2MB P shared
L3 16MB	L3 -

Memory

Type LPDDR5X·DDR5	Type DDR3L
Max Memory 256GB	Max Memory -
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 1600MT/s
Bandwidth 128GB/s	Bandwidth 25.6GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s

Power & Thermals

TDP 28W	TDP 6W
cTDP-down 15W	cTDP-down 4W
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 2.0 x4 2GB/sBandwidth

iGPU

iGPU Radeon 840M 2900MHz	iGPU HD 640MHz 12EU Gen 8
Shaders 256	Shaders 96
Boost Clock 2.9GHz	Boost Clock 640MHz
Peak·FP32·FP16 2.97 TFLOPSFP16	Peak·FP32·FP16 245.8 GFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Airmont
Family Ryzen AI 300	Family Celeron
Branding	Branding
Codename Strix Point Zen 5P-Core Zen 5cE-Core	Codename Braswell - -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Mar 1, 2015

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node 14nm
Die Size 233mm²	Die Size 87mm²
Transistor Count 28 Billion	Transistor Count 1.3 Billion
Transistor Density 120 MTr/mm²	Transistor Density 15 MTr/mm²

Images

No images available

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Used In

Laptops Framework 13(Early 2025)

Laptops -

Competitors

AMDRyzen AI 5 340 vs CPU AMDRyzen AI 5 PRO 340 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 240 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 PRO 220 Show 12 more

IntelCeleron N3150 vs CPU AMDRyzen 3 PRO 210 IntelCeleron N3150 vs CPU AMDRyzen 3 210 IntelCeleron N3150 vs CPU AMDRyzen AI 5 PRO 340 Show 9 more