AMD Ryzen AI 5 340 vs Qualcomm Snapdragon X Plus (X1P-42-100) Full Specs

Summary

6 Cores(3P+3E) 12 Threads(6P+6E) 2GHz	8 Cores 8 Threads 3.2GHz
TDP 28W	TDP 23W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 135.2GB/s LPDDR5X
iGPU Radeon 840M 2900MHz	iGPU Adreno X1 1.7T
Peak·FP32·FP16 2.97 TFLOPSFP16	Peak·FP32·FP16 3.41 TFLOPSFP16
Socket FP8	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 5 340-

-

Snapdragon X Plus (X1P-42-100)2,288

x1

Show Top Score

Core Config

6 Cores 3P 3E	8 Cores 8P -
12 Threads 6P 6E	8 Threads 8P -

Clocks

Base Clock 2GHz	Base Clock 3.2GHz
Boost Clock 4.8GHz	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 192KB P
L1d 48KB P	L1d 96KB P
L2 1MB P -	L2 24MB P shared
L3 16MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 256GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 8448MT/s
Bandwidth 128GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 28W	TDP 23W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Radeon 840M 2900MHz	iGPU Adreno X1 1.7T
Shaders 256	Shaders 1024
Boost Clock 2.9GHz	Boost Clock 833MHz
Peak·FP32·FP16 2.97 TFLOPSFP16	Peak·FP32·FP16 3.41 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model Hexagon
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance 45 TOPSINT8

Chip

Manufacturer AMD	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture OryonARMv8.7-A
Family Ryzen AI 300	Family X Series
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 4, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N4P
Die Size 233mm²	Die Size 170mm²
Transistor Count 28 Billion	Transistor Count -
Transistor Density 120 MTr/mm²	Transistor Density -

Images

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Used In

Laptops Framework 13(Early 2025)

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)

Competitors

AMDRyzen AI 5 340 vs CPU AMDRyzen AI 5 PRO 340 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 230 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 PRO 220 Show 12 more

QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen 9 270 QualcommSnapdragon X Plus (X1P-42-100) vs CPU AMDRyzen 7 260 Show 12 more