AMD Ryzen AI 7 350 vs Intel Atom N550 Full Specs

Summary

8 Cores(4P+4E) 16 Threads(8P+8E) 2GHz	2 Cores 4 Threads 1.5GHz
TDP 28W	TDP 8.5W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 3.2GB/s DDR3·DDR2
iGPU Radeon 860M 3000MHz	iGPU GMA 3150 200MHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 6.4 GFLOPSFP32
Socket FP8	Socket BGA 559

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 7 350-

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Atom N55065

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Core Config

8 Cores 4P 4E	2 Cores 2P -
16 Threads 8P 8E	4 Threads 4P -

Clocks

Base Clock 2GHz	Base Clock 1.5GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 24KB P
L2 1MB P	L2 512KB P
L3 16MB	L3 -

Memory

Type LPDDR5X·DDR5	Type DDR3·DDR2
Max Memory 256GB	Max Memory 2GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 32-bit
Speed 8000MT/s	Speed 800MT/s
Bandwidth 128GB/s	Bandwidth 3.2GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate800MT/s Calculated Bandwidth 3.2GB/s

Power & Thermals

TDP 28W	TDP 8.5W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

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iGPU

iGPU Radeon 860M 3000MHz	iGPU GMA 3150 200MHz
Shaders 384	Shaders 16
Boost Clock 3GHz	Boost Clock 200MHz
Peak·FP32·FP16 4.61 TFLOPSFP16	Peak·FP32·FP16 6.4 GFLOPSFP32

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Bonnell
Family Ryzen AI 300	Family Atom
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Pineview Pineview-2CVariant PineviewP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Aug 23, 2010

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node 45nm
Die Size 233mm²	Die Size 87mm²
Transistor Count 28 Billion	Transistor Count 176 Million
Transistor Density 120 MTr/mm²	Transistor Density 2 MTr/mm²

Images

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Used In

Laptops Framework 13(Early 2025)

Laptops -

Competitors

AMDRyzen AI 7 350 vs CPU AMDRyzen AI 7 PRO 350 AMDRyzen AI 7 350 vs CPU AMDRyzen 9 270 AMDRyzen AI 7 350 vs CPU AMDRyzen 7 PRO 250 Show 12 more

IntelAtom N550 vs CPU AMDRyzen AI 7 PRO 350 IntelAtom N550 vs CPU AMDRyzen 3 210 IntelAtom N550 vs CPU AMDRyzen AI 5 PRO 340 Show 6 more