AMD Ryzen AI Max 385 vs Intel Core i7-12700K Full Specs

Summary

8 Cores 16 Threads 3.6GHz	12 Cores(8P+4E) 20 Threads(16P+4E) 3.6GHz
TDP 65W	TDP 125W
Bandwidth 256GB/s LPDDR5X	Bandwidth 76.8GB/s DDR5·DDR4
iGPU Radeon 8050S	iGPU UHD 770 1500MHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 1.54 TFLOPSFP16
Socket FP11	Socket LGA 1700

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 385-

-

Core i7-12700K2,555

x1

Show Top Score

Core Config

8 Cores 8P -	12 Cores 8P 4E
16 Threads 16P -	20 Threads 16P 4E

Clocks

Base Clock 3.6GHz	Base Clock 3.6GHz
Boost Clock 5GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 32KB P -	L1i 32KB P 64KB E
L1d 48KB P -	L1d 48KB P 32KB E
L2 1MB P -	L2 1.25MB P 2MB E shared
L3 32MB	L3 25MB

Memory

Type LPDDR5X	Type DDR5·DDR4
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 4800MT/s
Bandwidth 256GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate4800MT/s Calculated Bandwidth 76.8GB/s

Power & Thermals

TDP 65W	TDP 125W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Peak Power -	Peak Power 190W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type PCIe	Bus Type DMI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU UHD 770 1500MHz
Shaders 2048	Shaders 256
Boost Clock 2.8GHz	Boost Clock 1.5GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 1.54 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model GNA 3.0
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Alder Lake
Family Ryzen AI 300	Family Core 12th Gen
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Alder Lake-HX - Alder Lake-8P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jan 6, 2025	Release Date Nov 4, 2021

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node Intel 7 -
Die Size 71mm²	Die Size 202mm²
Transistor Count 8.3 Billion	Transistor Count 14.6 Billion
Transistor Density 118 MTr/mm²	Transistor Density 72 MTr/mm²

Images

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Used In

Desktops Framework Desktop(Early 2025)

Desktops XPS(XD8950, Late 2021)OMEN 40L(Mid 2022)OMEN 45L(Early 2022)

Competitors

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