AMD Ryzen AI Max 390 vs Apple M2 Pro (10C16G) Full Specs

Summary

12 Cores 24 Threads 3.2GHz	10 Cores(6P+4E) 10 Threads(6P+4E) 3.5GHz
TDP 65W	TDP 60W
Bandwidth 256GB/s LPDDR5X	Bandwidth 204.8GB/s LPDDR5
iGPU Radeon 8050S	iGPU 16-Core M2 Pro
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 5.73 TFLOPSFP16
Socket FP11	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max 3902,835

x1.06

M2 Pro (10C16G)2,680

x1

Show Top Score

Core Config

12 Cores 12P -	10 Cores 6P 4E
24 Threads 24P -	10 Threads 6P 4E

Clocks

Base Clock 3.2GHz	Base Clock 3.5GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 24MB P shared 4MB E shared
L3 64MB	L3 -
SLC Cache -	SLC Cache 24MB

Memory

Type LPDDR5X	Type LPDDR5
Max Memory 128GB	Max Memory 32GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 256-bit	Bus Width 256-bit
Speed 8000MT/s	Speed 6400MT/s
Bandwidth 256GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 65W	TDP 60W
cTDP-down 45W	cTDP-down -
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 8050S	iGPU 16-Core M2 Pro
Shaders 2048	Shaders 2048
Boost Clock 2.8GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 22.94 TFLOPSFP16	Peak·FP32·FP16 5.73 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H14 Selene
NPU Cores 32	NPU Cores 16
NPU Clock -	NPU Clock 2.1GHz
Performance 50 TOPSINT8	Performance 15.8 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 11ARMv8.5-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core -	Codename Rhodes-Chop - M2 ProVariant AvalancheP-Core BlizzardE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Jan 17, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCSoC	Other Foundries -
Fabrication Node N4X N5SoC	Fabrication Node N5P -
Die Size 141mm²	Die Size 295mm²
Transistor Count 16.6 Billion	Transistor Count 40 Billion
Transistor Density 118 MTr/mm²	Transistor Density 136 MTr/mm²

Images

No images available

No images available

Used In

Laptops -	Laptops MacBook Pro 14(M2 Pro, Early 2023)
Desktops -	Desktops Mac mini(M2 Pro, Early 2023)

Competitors

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AppleM2 Pro (10C16G) vs CPU AppleM5 Pro (15C16G) AppleM2 Pro (10C16G) vs CPU AppleM3 (8C9G-FL) AppleM2 Pro (10C16G) vs CPU AMDRyzen AI Max 385 Show 12 more