AMD Ryzen AI Max+ 395 vs Intel Pentium Gold 6405U Full Specs

Summary

16 Cores 32 Threads 3GHz	2 Cores 4 Threads 2.4GHz
TDP 65W	TDP 15W
Bandwidth 256GB/s LPDDR5X	Bandwidth 38.4GB/s DDR4·LPDDR3
iGPU Radeon 8060S	iGPU UHD 610 950MHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 182.4 GFLOPSFP16
Socket FP11	Socket BGA 1528

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI Max+ 3952,984

x6.63

Pentium Gold 6405U450

x1

Show Top Score

Core Config

16 Cores	2 Cores
32 Threads	4 Threads

Clocks

Base Clock 3GHz	Base Clock 2.4GHz
Boost Clock 5.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 32KB
L2 1MB	L2 256KB
L3 64MB	L3 2MB

Memory

Type LPDDR5X	Type DDR4·LPDDR3
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 256-bit	Bus Width 128-bit
Speed 8000MT/s	Speed 2400MT/s
Bandwidth 256GB/s	Bandwidth 38.4GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s

Power & Thermals

TDP 65W	TDP 15W
cTDP-down 45W	cTDP-down 13W
cTDP-up 120W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 4GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU Radeon 8060S	iGPU UHD 610 950MHz
Shaders 2560	Shaders 96
Boost Clock 2.9GHz	Boost Clock 950MHz
Peak·FP32·FP16 29.7 TFLOPSFP16	Peak·FP32·FP16 182.4 GFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model -
NPU Cores 32	NPU Cores -
Performance 50 TOPSINT8	Performance -

Controller

Controller Model -	Controller Model 400 Series U
Codename -	Codename Comet Lake
PCIe -	PCIe -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen 5	Architecture Skylake
Family Ryzen AI 300	Family Pentium
Branding	Branding
Codename Strix Halo EldoraDie - Zen 5P-Core	Codename Comet Lake-H - Comet Lake-4CVariant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Aug 21, 2019

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries - TSMCSoC	Other Foundries IntelPCH -
Fabrication Node N4X - N5SoC	Fabrication Node 14nm+++ 14nmPCH -
Die Size 141mm² -	Die Size 126mm² 37mm²PCH
Transistor Count 16.6 Billion	Transistor Count 2.1 Billion
Transistor Density 118 MTr/mm²	Transistor Density 17 MTr/mm²

Images

No images available

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Used In

Laptops -	Laptops Notebook Plus(Mid 2020)
Desktops Framework Desktop(Early 2025)	Desktops -

Competitors

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 Show 12 more

IntelPentium Gold 6405U vs CPU AMDRyzen AI 5 PRO 340 IntelPentium Gold 6405U vs CPU AMDRyzen AI 7 PRO 350 IntelPentium Gold 6405U vs CPU AMDRyzen AI 5 340 Show 11 more