Apple A10 Fusion vs Intel Pentium Gold 4425Y Full Specs

Summary

4 Cores(2P+2E) 4 Threads(2P+2E) 2.34GHz	2 Cores 4 Threads 1.7GHz
TDP 5W	TDP 6W
Bandwidth 25.6GB/s LPDDR4	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU PowerVR GT7600 Plus A10	iGPU UHD 615 850MHz
Peak·FP32·FP16 774.1 GFLOPSFP16	Peak·FP32·FP16 326.4 GFLOPSFP16
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

A10 Fusion874

x2.06

Pentium Gold 4425Y425

x1

Show Top Score

Core Config

4 Cores 2P 2E	2 Cores 2P -
4 Threads 2P 2E	4 Threads 4P -

Clocks

Base Clock 2.34GHz	Base Clock 1.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 32KB E	L1i 32KB P -
L1d 64KB P 32KB E	L1d 32KB P -
L2 3MB P shared 1MB E shared	L2 256KB P - -
L3 4MB	L3 2MB

Memory

Type LPDDR4	Type LPDDR3·DDR3L
Max Memory 3GB	Max Memory 16GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 3200MT/s	Speed 1866MT/s
Bandwidth 25.6GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 6W
cTDP-down -	cTDP-down 5W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU PowerVR GT7600 Plus A10	iGPU UHD 615 850MHz
Shaders 192	Shaders 192
Boost Clock 1.01GHz	Boost Clock 850MHz
Peak·FP32·FP16 774.1 GFLOPSFP16	Peak·FP32·FP16 326.4 GFLOPSFP16

Controller

Controller Model -	Controller Model 300 Series Y+
Codename -	Codename Amber Lake
PCIe -	PCIe -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 6ARMv8.1-A	Architecture Skylake
Family A Series	Family Pentium
Branding	Branding
Codename Cayman A10Variant HurricaneP-Core ZephyrE-Core	Codename Amber Lake-Y Amber Lake-2CVariant - -
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 16, 2016	Release Date Jan 7, 2018

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 16FFC -	Fabrication Node 14nm++ 22nmPCH
Die Size 125mm² -	Die Size 103mm² 52mm²PCH
Transistor Count 3.3 Billion	Transistor Count 1.8 Billion
Transistor Density 26 MTr/mm²	Transistor Density 17 MTr/mm²

Images

No images available

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Used In

Smartphones iPhone 7iPhone 7 Plus	Smartphones -
Tablets iPad 6(A10, Early 2018)iPad 7(A10, Late 2019)	Tablets Surface Go 2(Amber Lake, Mid 2020)

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