Apple A16 (iPad) vs MediaTek Helio P22T Full Specs

Summary

5 Cores(2P+3E) 5 Threads(2P+3E) 3.44GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.3GHz
TDP 5W	TDP 10W
Bandwidth 51.2GB/s LPDDR5	Bandwidth 9.6GB/s LPDDR4
iGPU 4-Core A16	iGPU PowerVR GE8320 650MHz
Peak·FP32·FP16 1.37 TFLOPSFP16	Peak·FP32·FP16 83.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A16 (iPad)2,586

x1

Helio P22T-

-

Show Top Score

Core Config

5 Cores 2P 3E	8 Cores 4P 4E
5 Threads 2P 3E	8 Threads 4P 4E

Clocks

Base Clock 3.44GHz	Base Clock 2.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P 16KB E
L1d 128KB P 64KB E	L1d 16KB P 16KB E
L2 16MB P shared 4MB E shared	L2 128KB E 1MB P shared -
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR4
Max Memory 8GB	Max Memory -
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 6400MT/s	Speed 2400MT/s
Bandwidth 51.2GB/s	Bandwidth 9.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 9.6GB/s

Power & Thermals

TDP 5W

TDP 10W

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

-

iGPU

iGPU 4-Core A16	iGPU PowerVR GE8320 650MHz
Shaders 512	Shaders 32
Boost Clock 1.34GHz	Boost Clock 650MHz
Peak·FP32·FP16 1.37 TFLOPSFP16	Peak·FP32·FP16 83.2 GFLOPSFP16

NPU

NPU Model H15 Themis	NPU Model -
NPU Cores 16	NPU Cores -
NPU Clock 2.06GHz	NPU Clock -
Performance 17 TOPSFP16	Performance -

Cellular

Modem Model -	Modem Model MT LTE 4
Peak Down -	Peak Down Up to 150Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer Apple	Manufacturer MediaTek
ISA AArch64	ISA AArch64
Architecture Apple Silicon 12ARMv8.6-A	Architecture ARMv8.0-A
Family A Series	Family Helio
Branding	Branding
Codename Crete A16Variant EverestP-Core Sawtooth E-Core	Codename - - Cortex-A53P-Core Cortex-A53E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 4, 2025	Release Date Feb 1, 2018

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N4P	Fabrication Node 28nm LP
Die Size 115mm²	Die Size -
Transistor Count 16 Billion	Transistor Count -
Transistor Density 139 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Tablets iPad 11(A16, Early 2025)

Tablets Galaxy Tab A7 Lite(Helio P22T, Mid 2021)

Competitors

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