Apple A19 (17e) vs Qualcomm Snapdragon 200 (MSM8212) Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz	4 Cores 4 Threads 1.2GHz
TDP 5W	TDP 5W
Bandwidth 68.3GB/s LPDDR5X	Bandwidth 2.7GB/s LPDDR2
iGPU 4-Core A19	iGPU Adreno 302
Peak·FP32·FP16 3.01 TFLOPSFP16	Peak·FP32·FP16 25.6 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A19 (17e)3,608

x1

Snapdragon 200 (MSM8212)-

-

Show Top Score

Core Config

6 Cores 2P 4E	4 Cores 4P -
6 Threads 2P 4E	4 Threads 4P -

Clocks

Base Clock 4.26GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P -
L1d 128KB P 64KB E	L1d 16KB P -
L2 8MB P shared 4MB E shared	L2 512KB P shared -
SLC Cache 12MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR2
Max Memory 8GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 8533MT/s	Speed 666MT/s
Bandwidth 68.3GB/s	Bandwidth 2.7GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 68.3GB/s	Bandwidth Calculator Channels Transfer Rate666MT/s Calculated Bandwidth 2.7GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 11W	Peak Power -

Expansion

PCIe PCIe 4.0 x3 5.9GB/sBandwidth

-

iGPU

iGPU 4-Core A19	iGPU Adreno 302
Shaders 512	Shaders 16
Boost Clock 1.47GHz	Boost Clock 400MHz
Peak·FP32·FP16 3.01 TFLOPSFP16	Peak·FP32·FP16 25.6 GFLOPSFP16

NPU

NPU Model H18 Apollo	NPU Model Hexagon QDSP6
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock -
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model Gobi 2000
Peak Down -	Peak Down Up to 7.2Mbps
Peak Up -	Peak Up Up to 5.8Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture Apple Silicon 15ARMv9.2-A	Architecture ARMv7-A
Family A Series	Family 2 Series
Branding	Branding
Codename Tilos A19Variant AS15PP-Core AS15EE-Core	Codename - - Cortex-A7P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 2, 2026	Release Date Jul 1, 2013

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 45nm
Die Size 83mm²	Die Size -
Transistor Count 14.3 Billion	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Smartphones iPhone 17e

Smartphones -

Competitors

AppleA19 (17e) vs CPU AppleA18 Pro (Neo) AppleA19 (17e) vs CPU AppleA18 (16e) AppleA19 (17e) vs CPU AppleA18 Show 12 more

QualcommSnapdragon 200 (MSM8212) vs CPU AppleA16 (iPad) QualcommSnapdragon 200 (MSM8212) vs CPU AppleA18 Pro (Neo) QualcommSnapdragon 200 (MSM8212) vs CPU AppleA19 Pro Show 12 more