Apple A19 (17e) vs UNISOC W517 Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz	4 Cores(1P+3E) 4 Threads(1P+3E) 2GHz
TDP 5W	TDP 3W
Bandwidth 68.3GB/s LPDDR5X	Bandwidth 9.6GB/s LPDDR4X·LPDDR3
iGPU 4-Core A19	iGPU PowerVR GE8300 800MHz
Peak·FP32·FP16 3.01 TFLOPSFP16	Peak·FP32·FP16 51.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A19 (17e)3,608

x1

W517-

-

Show Top Score

Core Config

6 Cores 2P 4E	4 Cores 1P 3E
6 Threads 2P 4E	4 Threads 1P 3E

Clocks

Base Clock 4.26GHz	Base Clock 2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P 32KB E
L1d 128KB P 64KB E	L1d 32KB P 32KB E
L2 8MB P shared 4MB E shared	L2 512KB P 128KB E - -
SLC Cache 12MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR4X·LPDDR3
Max Memory 8GB	Max Memory -
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 8533MT/s	Speed 2400MT/s
Bandwidth 68.3GB/s	Bandwidth 9.6GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 68.3GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 9.6GB/s

Power & Thermals

TDP 5W	TDP 3W
Peak Power 11W	Peak Power -

Expansion

PCIe PCIe 4.0 x3 5.9GB/sBandwidth

-

iGPU

iGPU 4-Core A19	iGPU PowerVR GE8300 800MHz
Shaders 512	Shaders 16
Boost Clock 1.47GHz	Boost Clock 800MHz
Peak·FP32·FP16 3.01 TFLOPSFP16	Peak·FP32·FP16 51.2 GFLOPSFP16

NPU

NPU Model H18 Apollo	NPU Model -
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock -
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model UNISOC LTE 4
Peak Down -	Peak Down Up to 150Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer Apple	Manufacturer UNISOC
ISA AArch64	ISA AArch64
Architecture Apple Silicon 15ARMv9.2-A	Architecture ARMv8.2-A
Family A Series	Family -
Branding	Branding
Codename Tilos A19Variant AS15PP-Core AS15EE-Core	Codename - - Cortex-A75P-Core Cortex-A55E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Mar 2, 2026	Release Date Sep 6, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3P	Fabrication Node N7
Die Size 83mm²	Die Size -
Transistor Count 14.3 Billion	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Smartphones iPhone 17e

Smartphones -

Competitors

AppleA19 (17e) vs CPU AppleA18 Pro (Neo) AppleA19 (17e) vs CPU AppleA18 (16e) AppleA19 (17e) vs CPU AppleA18 Show 12 more

UNISOCW517 vs CPU AppleA16 (iPad) UNISOCW517 vs CPU AppleA17 Pro UNISOCW517 vs CPU AppleA18 Pro (Neo) Show 12 more