GPUs

Apple 4-Core A19 vs Imagination PowerVR GE8300 800MHz Full Specs

512 Shaders
1.47GHz
16 Shaders
800MHz
Shared Memory68.3GB/sLPDDR5X
Shared Memory10.7GB/s
··
··
1.5 TFLOPS
··
25.6 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

4-Core A194-Core A193.01 TFLOPSFP8-16 Tensor
x58.80
PowerVR GE8300 800MHzPowerVR GE8300 800MHz51.2 GFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
3.01 TFLOPSFP8-16 Tensor
Peak OPS
51.2 GFLOPSFP16
Tensor FP8-16
3.01 TFLOPS
Tensor FP8-32
3.01 TFLOPS
-
Tensor FP16-16
1.5 TFLOPS
Tensor FP16-32
1.5 TFLOPS
-
FP32
1.5 TFLOPS
FP32
25.6 GFLOPS
Pixel Rate
23.5 GPixel/s
Pixel Rate
0.8 GPixel/s
Texture Rate
47 GTexel/s
Texture Rate
0.8 GTexel/s

Shaders
512 Shaders
Shaders
16 Shaders
TMUs
32 TMUs
TMUs
1 TMU
ROPs
16 ROPs
ROPs
1 ROP
Tensor Cores
4 T-Cores
Tensor Cores
-
RT Cores
4 RT-Cores
RT Cores
-
EUs
64 EUs
EU
1 EU

Boost Clock
1.47GHz
Boost Clock
800MHz

L2 Cache
1MB shared
L2 Cache
-

Shared MemoryLPDDR5X
Shared Memory
··
Memory Bus
64-bit
Memory Bus
32-bit
Memory Speed
8.5GT/s
Memory Speed
2.7GT/s
Memory Bandwidth
68.3GB/s
Memory Bandwidth
10.7GB/s
ECC
No
ECC
No

Multi-Monitor
1
Multi-Monitor
-

Encoder Model
Apple Media Engine 3
-

Decoder Model
Apple Media Engine 3
-

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
A19 branding
Branding
PowerVR 2013 branding
Codename
G18A
Codename
Series8XE
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Mar 2, 2026
Release Date
May 1, 2019

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3P
Fabrication Node
N7
Die Size
83mm²
Die Size
-
Transistor Count
14.3 Billion
Transistor Count
-
Transistor Density
172 MTr/mm²
Transistor Density
-

No images available
No images available

CPUs
CPUs
Smartphones
Smartphones
-