Apple A19 Pro vs Qualcomm Snapdragon 215 Full Specs

Summary

6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz	4 Cores 4 Threads 1.3GHz
TDP 5W	TDP 5W
Bandwidth 76.8GB/s LPDDR5X	Bandwidth 5.4GB/s LPDDR2
iGPU 6-Core A19 Pro	iGPU Adreno 308
Peak·FP32·FP16 4.98 TFLOPSFP16	Peak·FP32·FP16 48 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A19 Pro3,895

x1

Snapdragon 215-

-

Show Top Score

Core Config

6 Cores 2P 4E	4 Cores 4P -
6 Threads 2P 4E	4 Threads 4P -

Clocks

Base Clock 4.26GHz	Base Clock 1.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P -
L1d 128KB P 64KB E	L1d 16KB P -
L2 16MB P shared 6MB E shared	L2 512KB P shared -
SLC Cache 32MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR2
Max Memory 12GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 64-bit	Bus Width 32-bit
Speed 9600MT/s	Speed 1344MT/s
Bandwidth 76.8GB/s	Bandwidth 5.4GB/s
Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 76.8GB/s	Bandwidth Calculator Channels Transfer Rate1344MT/s Calculated Bandwidth 5.4GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 12W	Peak Power -

Expansion

PCIe PCIe 4.0 x5 9.8GB/sBandwidth

-

iGPU

iGPU 6-Core A19 Pro	iGPU Adreno 308
Shaders 768	Shaders 24
Boost Clock 1.62GHz	Boost Clock 500MHz
Peak·FP32·FP16 4.98 TFLOPSFP16	Peak·FP32·FP16 48 GFLOPSFP16

NPU

NPU Model H18 Apollo	NPU Model Hexagon
NPU Cores 16	NPU Cores -
NPU Clock 2.17GHz	NPU Clock -
Performance 35 TOPSINT8	Performance -

Cellular

Modem Model -	Modem Model X5
Peak Down -	Peak Down Up to 150Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 15ARMv9.2-A	Architecture ARMv8.0-A
Family A Series	Family 2 Series
Branding	Branding
Codename Thera A19 ProVariant AS15PP-Core AS15EE-Core	Codename - - Cortex-A53P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 9, 2025	Release Date Jul 9, 2019

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3P	Fabrication Node 28nm LP
Die Size 99mm²	Die Size -
Transistor Count 17 Billion	Transistor Count -
Transistor Density 172 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Smartphones iPhone 17 ProiPhone 17 Pro Max

Smartphones -

Competitors

AppleA19 Pro vs CPU AppleA18 Pro (Neo) AppleA19 Pro vs CPU AppleA18 (16e) AppleA19 Pro vs CPU AppleA18 Pro Show 12 more

QualcommSnapdragon 215 vs CPU AppleA16 (iPad) QualcommSnapdragon 215 vs CPU AppleA18 Pro (Neo) QualcommSnapdragon 215 vs CPU AppleA19 (17e) Show 12 more