Apple A9 (Samsung) vs Intel Core m3-7Y30 Full Specs

Summary

2 Cores 2 Threads 1.85GHz	2 Cores 4 Threads 1GHz
TDP 5W	TDP 5W
Bandwidth 25.6GB/s LPDDR4	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU PowerVR GT7600 A9	iGPU HD 615 900MHz
Peak·FP32·FP16 499.2 GFLOPSFP16	Peak·FP32·FP16 345.6 GFLOPSFP16
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

A9 (Samsung)644

x1

Core m3-7Y30777

x1.21

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Core Config

2 Cores	2 Cores
2 Threads	4 Threads

Clocks

Base Clock 1.85GHz	Base Clock 1GHz
Boost Clock -	Boost Clock 2.6GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB	L1i 32KB
L1d 64KB	L1d 32KB
L2 3MB shared	L2 256KB
L3 4MB	L3 4MB

Memory

Type LPDDR4	Type LPDDR3·DDR3L
Max Memory 2GB	Max Memory 16GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 3200MT/s	Speed 1866MT/s
Bandwidth 25.6GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 5W
cTDP-down -	cTDP-down 4W
cTDP-up -	cTDP-up 7W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU PowerVR GT7600 A9	iGPU HD 615 900MHz
Shaders 192	Shaders 192
Boost Clock 650MHz	Boost Clock 900MHz
Peak·FP32·FP16 499.2 GFLOPSFP16	Peak·FP32·FP16 345.6 GFLOPSFP16

Controller

Controller Model -	Controller Model 200 Series Y+
Codename -	Codename Kaby Lake
PCIe -	PCIe -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 4ARMv8.0-A	Architecture Skylake
Family A Series	Family Core 6th Gen
Branding	Branding
Codename Maui A9 SamsungVariant TwisterP-Core	Codename Kaby Lake-H Kaby Lake-2C-GT2Variant -
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 25, 2015	Release Date Jan 3, 2017

Fabrication

Foundry Samsung	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 14LPP -	Fabrication Node 14nm+ 22nmPCH
Die Size 96mm² -	Die Size 103mm² 50mm²PCH
Transistor Count 2.5 Billion	Transistor Count 1.8 Billion
Transistor Density 26 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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Used In

Smartphones iPhone 6SiPhone SE(Gen 1)	Smartphones -
Tablets iPad 5(A9, Early 2017)	Tablets Surface Pro 5(Intel 7th Gen, Mid 2017)

Competitors

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