Apple A9 (Samsung) vs Qualcomm Snapdragon 865+ Full Specs

Summary

2 Cores 2 Threads 1.85GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.1GHz
TDP 5W	TDP 5W
Bandwidth 25.6GB/s LPDDR4	Bandwidth 44GB/s LPDDR5·LPDDR4X
iGPU PowerVR GT7600 A9	iGPU Adreno 650+
Peak·FP32·FP16 499.2 GFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

A9 (Samsung)644

x1

Snapdragon 865+1,134

x1.76

Show Top Score

Core Config

2 Cores 2P - -	8 Cores 1P 3M 4E
2 Threads 2P - -	8 Threads 1P 3M 4E

Clocks

Base Clock 1.85GHz	Base Clock 3.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P - -	L1i 64KB P 64KB M 32KB E
L1d 64KB P - -	L1d 64KB P 64KB M 32KB E
L2 3MB P shared	L2 512KB P 256KB M 128KB E -
L3 4MB	L3 4MB
SLC Cache -	SLC Cache 3MB

Memory

Type LPDDR4	Type LPDDR5·LPDDR4X
Max Memory 2GB	Max Memory 24GB
ECC No	ECC No
Channels 1	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 3200MT/s	Speed 5500MT/s
Bandwidth 25.6GB/s	Bandwidth 44GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU PowerVR GT7600 A9	iGPU Adreno 650+
Shaders 192	Shaders 768
Boost Clock 650MHz	Boost Clock 670MHz
Peak·FP32·FP16 499.2 GFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16

NPU

NPU Model -	NPU Model Hexagon 698
NPU Clock -	NPU Clock 576MHz
Performance -	Performance 15 TOPS

Cellular

Modem Model -	Modem Model X55
Cellular -	Cellular 5G mmWave
Peak Down -	Peak Down Up to 7.5Gbps
Peak Up -	Peak Up Up to 3.0Gbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 4ARMv8.0-A	Architecture Kryo 585ARMv8.2-A
Family A Series	Family 8 Series
Branding	Branding
Codename Maui A9 SamsungVariant TwisterP-Core - -	Codename - - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 25, 2015	Release Date Aug 30, 2020

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N7P
Die Size 96mm²	Die Size 84mm²
Transistor Count 2.5 Billion	Transistor Count 10.3 Billion
Transistor Density 26 MTr/mm²	Transistor Density 123 MTr/mm²

Images

No images available

No images available

Used In

Smartphones iPhone 6SiPhone SE(Gen 1)	Smartphones -
Tablets iPad 5(A9, Early 2017)	Tablets Galaxy Tab S7(SD 865+, Mid 2020)Galaxy Tab S7+(SD 865+, Mid 2020)

Competitors

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