CPUs

Apple M1 (8C7G) vs Apple M2 Pro (10C16G) Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
3.2GHz
10 Cores(6P+4E)
10 Threads(6P+4E)
3.5GHz
TDP
10W
TDP
60W
Bandwidth
68.3GB/s
LPDDR4X
Bandwidth
204.8GB/s
LPDDR5
iGPU
iGPU
··
2.29 TFLOPSFP16
··
5.73 TFLOPSFP16

8 Cores
4P
4E
10 Cores
6P
4E
8 Threads
4P
4E
10 Threads
6P
4E

Base Clock
3.2GHz
Base Clock
3.5GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
192KB P
128KB E
L1d
128KB P
64KB E
L1d
128KB P
64KB E
L2
12MB P shared
4MB E shared
L2
24MB P shared
4MB E shared
SLC Cache
8MB
SLC Cache
24MB

Type
LPDDR4X
Type
LPDDR5
Max Memory
16GB
Max Memory
32GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
128-bit
Bus Width
256-bit
Speed
4266MT/s
Speed
6400MT/s
Bandwidth
68.3GB/s
Bandwidth
204.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
204.8GB/s

TDP
10W
TDP
60W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max

PCIe
PCIe 4.0 x5
9.8GB/sBandwidth
PCIe
PCIe 4.0 x16
31.5GB/sBandwidth

iGPU
iGPU
Shaders
896
Shaders
2048
Boost Clock
1.28GHz
Boost Clock
1.4GHz
··
2.29 TFLOPSFP16
··
5.73 TFLOPSFP16

NPU Model
H13 Styx
NPU Model
H14 Selene
NPU Cores
16
NPU Cores
16
NPU Clock
1.46GHz
NPU Clock
2.1GHz
Performance
11 TOPSFP16
Performance
15.8 TOPSFP16

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
M1  branding
Branding
M2 Pro  branding
Codename
Tonga
M1Variant
FirestormP-Core
IcestormE-Core
Codename
Rhodes-Chop
M2 ProVariant
AvalancheP-Core
BlizzardE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Nov 10, 2020
Release Date
Jan 17, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5
Fabrication Node
N5P
Die Size
123mm²
Die Size
295mm²
Transistor Count
16 Billion
Transistor Count
40 Billion
Transistor Density
130 MTr/mm²
Transistor Density
136 MTr/mm²