CPUs

Apple M1 (8C8G-FL) vs Qualcomm Snapdragon 662 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
3.2GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
TDP
10W
TDP
5W
Bandwidth
68.3GB/s
LPDDR4X
Bandwidth
14.9GB/s
LPDDR4X
iGPU
iGPU
··
2.62 TFLOPSFP16
··
486.4 GFLOPSFP16

M1 (8C8G-FL)M1 (8C8G-FL)2,380
x7.19
Snapdragon 662Snapdragon 662331
x1

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
3.2GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
32KB P
16KB E
L1d
128KB P
64KB E
L1d
32KB P
16KB E
L2
12MB P shared
4MB E shared
L2
2MB P shared
1MB E shared
SLC Cache
8MB
SLC Cache
-

Type
LPDDR4X
Type
LPDDR4X
Max Memory
16GB
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
32-bit
Speed
4266MT/s
Speed
3733MT/s
Bandwidth
68.3GB/s
Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
14.9GB/s

TDP
10W
TDP
5W
Max Operating Temp
100°C Max
Max Operating Temp
-

PCIe
PCIe 4.0 x5
9.8GB/sBandwidth
-

iGPU
iGPU
Shaders
1024
Shaders
128
Boost Clock
1.28GHz
Boost Clock
950MHz
··
2.62 TFLOPSFP16
··
486.4 GFLOPSFP16

NPU Model
H13 Styx
NPU Model
Hexagon 683
NPU Cores
16
NPU Cores
-
NPU Clock
1.46GHz
NPU Clock
-
Performance
11 TOPSFP16
Performance
-

Modem Model
-
Modem Model
X11
Peak Down
-
Peak Down
Up to 390Mbps
Peak Up
-
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 260ARMv8.0-A
Family
Family
Branding
M1  branding
Branding
Snapdragon  branding
Codename
Tonga
M1Variant
FirestormP-Core
IcestormE-Core
Codename
-
-
Cortex-A73P-Core
Cortex-A53E-Core
Market Segment
Tablet
Market Segment
Smartphone
Release Date
Nov 10, 2020
Release Date
Jan 20, 2020

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N5
Fabrication Node
14LPP
Die Size
123mm²
Die Size
-
Transistor Count
16 Billion
Transistor Count
-
Transistor Density
130 MTr/mm²
Transistor Density
-

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