Apple M1 Max (10C24G) vs Intel Core Ultra 5 226V Full Specs

Summary

10 Cores(8P+2E) 10 Threads(8P+2E) 3.23GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz
TDP 110W	TDP 17W
Bandwidth 409.6GB/s LPDDR5	Bandwidth 136.5GB/s LPDDR5X
iGPU 24-Core M1 Max	iGPU Arc 130V 1850MHz
Peak·FP32·FP16 7.96 TFLOPSFP16	Peak·FP32·FP16 106.1 TOPSINT4 Tensor
Socket -	Socket BGA 2833

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M1 Max (10C24G)2,400

x1

Core Ultra 5 226V2,543

x1.06

Show Top Score

Core Config

10 Cores 8P 2E	8 Cores 4P 4E
10 Threads 8P 2E	8 Threads 4P 4E

Clocks

Base Clock 3.23GHz	Base Clock 2.1GHz
Boost Clock -	Boost Clock 4.5GHz
Overclocking Locked	Overclocking Locked

Cache

L0i -	L0i 64KB
L0d -	L0d 48KB
L1i 192KB P 128KB E	L1i - 64KB E
L1d 128KB P 64KB E	L1d 192KB P 32KB E
L2 24MB P shared 4MB E shared	L2 2.5MB P - 4MB E shared
L3 -	L3 8MB
SLC Cache 48MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 64GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 512-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 8533MT/s
Bandwidth 409.6GB/s	Bandwidth 136.5GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 409.6GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s

Power & Thermals

TDP 110W	TDP 17W
cTDP-down -	cTDP-down 8W
Peak Power -	Peak Power 37W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Expansion

PCIe PCIe 4.0 x14 27.6GB/sBandwidth	PCIe PCIe 5.0 x4 15.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 24-Core M1 Max	iGPU Arc 130V 1850MHz
Shaders 3072	Shaders 896
Boost Clock 1.3GHz	Boost Clock 1.85GHz
Peak·FP32·FP16 7.96 TFLOPSFP16	Peak·FP32·FP16 106.1 TOPSINT4 Tensor

NPU

NPU Model H13 Eos	NPU Model AI Boost 4
NPU Cores 16	NPU Cores 5
NPU Clock 1.5GHz	NPU Clock -
Performance 11 TOPSFP16	Performance 40 TOPSINT8

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 10ARMv8.5-A	Architecture Lunar Lake
Family M Series	Family Core Ultra Series 2
Branding	Branding
Codename Jade-C M1 MaxVariant FirestormP-Core IcestormE-Core	Codename Lunar Lake-V Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core
Market Segment Desktop	Market Segment Laptop
Release Date Oct 26, 2021	Release Date Sep 3, 2024
Part Number APL 1105	Part Number QQ8076606107, QQ8076606108
S-Spec -	S-Spec SRPMQ, SRPMR
	Official specs

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries IntelFIB TSMCIO
Fabrication Node N5 - -	Fabrication Node N3B 22nmFIB N6IO
Die Size 432mm² -	Die Size 140mm² 46mm²IO
Transistor Count 57B	Transistor Count -
Transistor Density 132 MTr/mm²	Transistor Density -

Images