CPUs

Apple M2 (8C10G-FL) vs Qualcomm Snapdragon 778G Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
3.49GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.4GHz
TDP
15W
TDP
5W
Bandwidth
102.4GB/s
LPDDR5
Bandwidth
25.6GB/s
LPDDR5
iGPU
iGPU
··
3.58 TFLOPSFP16
··
1.13 TFLOPSFP16

8 Cores
4P
-
4E
8 Cores
1P
3M
4E
8 Threads
4P
-
4E
8 Threads
1P
3M
4E

Base Clock
3.49GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
-
128KB E
L1i
64KB P
64KB M
32KB E
L1d
128KB P
-
64KB E
L1d
64KB P
64KB M
32KB E
L2
16MB P shared
4MB E shared
L2
512KB P
512KB M
128KB E
-
-
SLC Cache
8MB
SLC Cache
3MB

Type
LPDDR5
Type
LPDDR5
Max Memory
24GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
32-bit
Speed
6400MT/s
Speed
6400MT/s
Bandwidth
102.4GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
102.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s

TDP
15W
TDP
5W
Max Operating Temp
100°C Max
Max Operating Temp
-

PCIe
PCIe 4.0 x6
11.8GB/sBandwidth
-

iGPU
iGPU
Shaders
1280
Shaders
512
Boost Clock
1.4GHz
Boost Clock
550MHz
··
3.58 TFLOPSFP16
··
1.13 TFLOPSFP16

NPU Model
H14 Bia
NPU Model
Hexagon 770
NPU Cores
16
NPU Cores
-
NPU Clock
2.1GHz
NPU Clock
-
Performance
15.8 TOPSFP16
Performance
12 TOPS

Modem Model
-
Modem Model
X53
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 3.7Gbps
Peak Up
-
Peak Up
Up to 2.9Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 670ARMv8.2-A
Family
Family
Branding
M2  branding
Branding
Snapdragon  branding
Codename
Staten
M2Variant
AvalancheP-Core
-
BlizzardE-Core
Codename
-
-
Cortex-A78P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Market Segment
Tablet
Market Segment
Smartphone
Release Date
Jun 6, 2022
Release Date
May 19, 2021

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5P
Fabrication Node
N6
Die Size
153mm²
Die Size
-
Transistor Count
20.1 Billion
Transistor Count
-
Transistor Density
131 MTr/mm²
Transistor Density
-