CPUs

Apple M2 Max (12C30G) vs Apple M3 Pro (11C14G) Full Specs

12 Cores(8P+4E)
12 Threads(8P+4E)
3.69GHz
11 Cores(5P+6E)
11 Threads(5P+6E)
4.05GHz
TDP
140W
TDP
60W
Bandwidth
409.6GB/s
LPDDR5
Bandwidth
153.6GB/s
LPDDR5
iGPU
iGPU
··
10.74 TFLOPSFP16
··
4.95 TFLOPSFP16

M2 Max (12C30G)M2 Max (12C30G)2,825
x1
M3 Pro (11C14G)M3 Pro (11C14G)3,140
x1.11

12 Cores
8P
4E
11 Cores
5P
6E
12 Threads
8P
4E
11 Threads
5P
6E

Base Clock
3.69GHz
Base Clock
4.05GHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
192KB P
128KB E
L1d
128KB P
64KB E
L1d
128KB P
64KB E
L2
24MB P shared
4MB E shared
L2
24MB P shared
4MB E shared
SLC Cache
48MB
SLC Cache
12MB

Type
LPDDR5
Type
LPDDR5
Max Memory
64GB
Max Memory
36GB
ECC
No
ECC
No
Channels
4
Channels
3
Bus Width
512-bit
Bus Width
192-bit
Speed
6400MT/s
Speed
6400MT/s
Bandwidth
409.6GB/s
Bandwidth
153.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
409.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
153.6GB/s

TDP
140W
TDP
60W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max

PCIe
PCIe 4.0 x16
31.5GB/sBandwidth
PCIe
PCIe 4.0 x8
15.8GB/sBandwidth

iGPU
iGPU
Shaders
3840
Shaders
1792
Boost Clock
1.4GHz
Boost Clock
1.38GHz
··
10.74 TFLOPSFP16
··
4.95 TFLOPSFP16

NPU Model
H14 Selene
NPU Model
H15 Erebus
NPU Cores
16
NPU Cores
16
NPU Clock
2.1GHz
NPU Clock
2.36GHz
Performance
15.8 TOPSFP16
Performance
18 TOPSFP16

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
M2 Max  branding
Branding
M3 Pro  branding
Codename
Rhodes-1C
M2 MaxVariant
AvalancheP-Core
BlizzardE-Core
Codename
Lobos
M3 ProVariant
EverestP-Core
Sawtooth E-Core
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jan 17, 2023
Release Date
Oct 30, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5P
Fabrication Node
N3B
Die Size
486mm²
Die Size
219mm²
Transistor Count
67 Billion
Transistor Count
37 Billion
Transistor Density
138 MTr/mm²
Transistor Density
169 MTr/mm²

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