Apple M2 Max (12C30G) vs Intel Core Ultra 5 226V Full Specs

Summary

12 Cores(8P+4E) 12 Threads(8P+4E) 3.69GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 4.5GHz
TDP 140W	TDP 17W
Bandwidth 409.6GB/s LPDDR5	Bandwidth 136.5GB/s LPDDR5X
iGPU 30-Core M2 Max	iGPU Arc 130V 1850MHz
Peak·FP32·FP16 10.74 TFLOPSFP16	Peak·FP32·FP16 106.1 TFLOPSFP16
Socket -	Socket BGA 2833

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Max (12C30G)2,825

x1.11

Core Ultra 5 226V2,543

x1

Show Top Score

Core Config

12 Cores 8P 4E	8 Cores 4P 4E
12 Threads 8P 4E	8 Threads 4P 4E

Clocks

Base Clock 3.69GHz	Base Clock 4.5GHz
Overclocking Locked	Overclocking Locked

Cache

L0i -	L0i 64KB
L0d -	L0d 48KB
L1i 192KB P 128KB E	L1i - 64KB E
L1d 128KB P 64KB E	L1d 192KB P 32KB E
L2 24MB P shared 4MB E shared	L2 2.5MB P - 4MB E shared
L3 -	L3 8MB
SLC Cache 48MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 64GB	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 512-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 8533MT/s
Bandwidth 409.6GB/s	Bandwidth 136.5GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 409.6GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 136.5GB/s

Power & Thermals

TDP 140W	TDP 17W
cTDP-down -	cTDP-down 8W
Peak Power -	Peak Power 37W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x4 15.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 30-Core M2 Max	iGPU Arc 130V 1850MHz
Shaders 3840	Shaders 896
Boost Clock 1.4GHz	Boost Clock 1.85GHz
Peak·FP32·FP16 10.74 TFLOPSFP16	Peak·FP32·FP16 106.1 TFLOPSFP16

NPU

NPU Model H14 Selene	NPU Model AI Boost 4
NPU Cores 16	NPU Cores 5
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance 40 TOPSINT8

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Lunar Lake
Family M Series	Family Core Ultra Series 2
Branding	Branding
Codename Rhodes-1C - M2 MaxVariant AvalancheP-Core BlizzardE-Core	Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core
Market Segment Desktop	Market Segment Laptop
Release Date Jan 17, 2023	Release Date Sep 3, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries IntelFIB TSMCIO
Fabrication Node N5P - -	Fabrication Node N3B 22nmFIB N6IO
Die Size 486mm² -	Die Size 140mm² 46mm²IO
Transistor Count 67 Billion	Transistor Count -
Transistor Density 138 MTr/mm²	Transistor Density -

Images

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Used In

Laptops MacBook Pro 14(M2 Max, Early 2023)MacBook Pro 16(M2 Max, Early 2023)	Laptops XPS 13(9350, Late 2024)Galaxy Book5 Pro 14(Early 2025)Galaxy Book5 Pro 16(Early 2025) Show 1 more
Desktops Mac Studio(M2 Max, Mid 2023)	Desktops -

Competitors

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