Apple M2 Pro (10C16G) vs AMD EPYC 7532 Full Specs

Summary

10 Cores(6P+4E) 10 Threads(6P+4E) 3.5GHz	32 Cores 64 Threads 2.4GHz
TDP 60W	TDP 200W
Bandwidth 204.8GB/s LPDDR5	Bandwidth 204.8GB/s DDR4
iGPU 16-Core M2 Pro	iGPU 0
Peak·FP32·FP16 5.73 TFLOPSFP16	Peak·FP32·FP16 -
Socket -	Socket SP3

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Pro (10C16G)2,680

x2.25

EPYC 75321,190

x1

Show Top Score

Core Config

10 Cores 6P 4E	32 Cores 32P -
10 Threads 6P 4E	64 Threads 64P -

Clocks

Base Clock 3.5GHz	Base Clock 2.4GHz
Boost Clock -	Boost Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 32KB P -
L2 24MB P shared 4MB E shared	L2 512KB P - -
L3 -	L3 256MB
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5	Type DDR4
Max Memory 32GB	Max Memory 4.1TB
ECC No	ECC Yes
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 512-bit
Speed 6400MT/s	Speed 3200MT/s
Bandwidth 204.8GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 60W	TDP 200W
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x128 252GB/sBandwidth

iGPU

iGPU 16-Core M2 Pro	iGPU 0
Shaders 2048	Shaders -
Boost Clock 1.4GHz	Boost Clock -
Peak·FP32·FP16 5.73 TFLOPSFP16	Peak·FP32·FP16 -

NPU

NPU Model H14 Selene	NPU Model -
NPU Cores 16	NPU Cores -
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance -

Chip

Manufacturer Apple	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Zen 2
Family M Series	Family EPYC 7002
Branding	Branding
Codename Rhodes-Chop - M2 ProVariant AvalancheP-Core BlizzardE-Core	Codename Rome Aspen HighlandsDie Rome 8CCDVariant - -
Market Segment Laptop	Market Segment Server
Release Date Jan 17, 2023	Release Date Aug 7, 2019

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries GlobalFoundriesIO
Fabrication Node N5P -	Fabrication Node N7 12LPIO
Die Size 295mm² -	Die Size 592mm² 416mm²IO
Transistor Count 40 Billion -	Transistor Count 30.4 Billion 8.3 BillionIO
Transistor Density 136 MTr/mm² -	Transistor Density 51 MTr/mm² 20 MTr/mm²IO

Images

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Used In

Laptops MacBook Pro 14(M2 Pro, Early 2023)	Laptops -
Desktops Mac mini(M2 Pro, Early 2023)	Desktops Tinybox Red(Mid 2024)Tinybox Green(Mid 2024)

Competitors

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