Apple M3 (8C9G-FL) vs MediaTek Helio P22T Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.3GHz
TDP 15W	TDP 10W
Bandwidth 102.4GB/s LPDDR5	Bandwidth 9.6GB/s LPDDR4
iGPU 9-Core M3-FL	iGPU PowerVR GE8320 650MHz
Peak·FP32·FP16 3.08 TFLOPSFP16	Peak·FP32·FP16 83.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M3 (8C9G-FL)3,130

x1

Helio P22T-

-

Show Top Score

Core Config

8 Cores 4P 4E	8 Cores 4P 4E
8 Threads 4P 4E	8 Threads 4P 4E

Clocks

Base Clock 4.05GHz	Base Clock 2.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 16KB P 16KB E
L1d 128KB P 64KB E	L1d 16KB P 16KB E
L2 16MB P shared 4MB E shared	L2 128KB E 1MB P shared -
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR4
Max Memory 24GB	Max Memory -
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 6400MT/s	Speed 2400MT/s
Bandwidth 102.4GB/s	Bandwidth 9.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 9.6GB/s

Power & Thermals

TDP 15W	TDP 10W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

-

iGPU

iGPU 9-Core M3-FL	iGPU PowerVR GE8320 650MHz
Shaders 1152	Shaders 32
Boost Clock 1.34GHz	Boost Clock 650MHz
Peak·FP32·FP16 3.08 TFLOPSFP16	Peak·FP32·FP16 83.2 GFLOPSFP16

NPU

NPU Model H15 Themis	NPU Model -
NPU Cores 16	NPU Cores -
NPU Clock 2.36GHz	NPU Clock -
Performance 18 TOPSFP16	Performance -

Cellular

Modem Model -	Modem Model MT LTE 4
Peak Down -	Peak Down Up to 150Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer Apple	Manufacturer MediaTek
ISA AArch64	ISA AArch64
Architecture Apple Silicon 13ARMv8.6-A	Architecture ARMv8.0-A
Family M Series	Family Helio
Branding	Branding
Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core	Codename - - Cortex-A53P-Core Cortex-A53E-Core
Market Segment Tablet	Market Segment Smartphone
Release Date Mar 4, 2025	Release Date Feb 1, 2018

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3B	Fabrication Node 28nm LP
Die Size 153mm²	Die Size -
Transistor Count 25 Billion	Transistor Count -
Transistor Density 164 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Tablets iPad Air 11" Gen 2(M3, Early 2025)iPad Air 13" Gen 2(M3, Early 2025)

Tablets Galaxy Tab A7 Lite(Helio P22T, Mid 2021)

Competitors

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