Apple M3 Pro (12C18G) vs Intel Core i9-13950HX Full Specs
12 Cores(6P+6E) 12 Threads(6P+6E) 4.05GHz | 24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz |
TDP 60W | TDP 55W |
Bandwidth 153.6GB/s LPDDR5 | Bandwidth 89.6GB/s · |
iGPU | iGPU |
·· 6.36 TFLOPSFP16 | ·· 1.69 TFLOPSFP16 |
Socket - | Socket |
M3 Pro (12C18G)3,140
Core i9-13950HX2,68012 Cores 6P 6E | 24 Cores 8P 16E |
12 Threads 6P 6E | 32 Threads 16P 16E |
Base Clock 4.05GHz | Base Clock 2.2GHz |
Boost Clock - | Boost Clock 5.5GHz |
Overclocking Locked | Overclocking Unlocked |
L1i 192KB P 128KB E | L1i 32KB P 64KB E |
L1d 128KB P 64KB E | L1d 48KB P 32KB E |
L2 24MB P shared 4MB E shared | L2 2MB P - 16MB E shared |
L3 - | L3 36MB |
SLC Cache 12MB | SLC Cache - |
Type LPDDR5 | Type · |
Max Memory 36GB | Max Memory 128GB |
ECC No | ECC No |
Channels 3 | Channels 2 |
Bus Width 192-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 5600MT/s |
Bandwidth 153.6GB/s | Bandwidth 89.6GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 153.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 89.6GB/s |
TDP 60W | TDP 55W |
Peak Power - | Peak Power 157W |
Max Operating Temp 100°C Max | Max Operating Temp 100°C Max |
Bus Type - | Bus Type DMI |
Bus Config - | Bus Config 8 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 16GB/s |
PCIe PCIe 4.0 x815.8GB/sBandwidth | PCIe PCIe 5.0 x1663GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 2304 | Shaders 256 |
Boost Clock 1.38GHz | Boost Clock 1.65GHz |
·· 6.36 TFLOPSFP16 | ·· 1.69 TFLOPSFP16 |
NPU Model H15 Erebus | NPU Model GNA 3.0 |
NPU Cores 16 | NPU Cores - |
NPU Clock 2.36GHz | NPU Clock - |
Performance 18 TOPSFP16 | Performance - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Apple Silicon 13ARMv8.6-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Lobos M3 ProVariant EverestP-Core Sawtooth E-Core | Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Oct 30, 2023 | Release Date Jan 1, 2023 |
Foundry TSMC | Foundry Intel |
Fabrication Node N3B | Fabrication Node Intel 7 |
Die Size 219mm² | Die Size 257mm² |
Transistor Count 37 Billion | Transistor Count 18.5 Billion |
Transistor Density 169 MTr/mm² | Transistor Density 72 MTr/mm² |
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