Apple M3 Ultra (28C60G) vs AMD EPYC 7532 Full Specs

Summary

28 Cores(20P+8E) 28 Threads(20P+8E) 4.05GHz	32 Cores 64 Threads 2.4GHz
TDP 300W	TDP 200W
Bandwidth 819.2GB/s LPDDR5	Bandwidth 204.8GB/s DDR4
iGPU 60-Core M3 Ultra	iGPU -
Peak·FP32·FP16 21.2 TFLOPSFP16	Peak·FP32·FP16 -
Socket -	Socket SP3

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M3 Ultra (28C60G)3,221

x2.71

EPYC 75321,190

x1

Show Top Score

Core Config

28 Cores 20P 8E	32 Cores 32P -
28 Threads 20P 8E	64 Threads 64P -

Clocks

Base Clock 4.05GHz	Base Clock 2.4GHz
Boost Clock -	Boost Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 32KB P -
L2 64MB P shared 4MB E shared	L2 512KB P - -
L3 -	L3 256MB
SLC Cache 96MB	SLC Cache -

Memory

Type LPDDR5	Type DDR4
Max Memory 128GB	Max Memory 4.1TB
ECC No	ECC Yes
Channels 8	Channels 8
Bus Width 1024-bit	Bus Width 512-bit
Speed 6400MT/s	Speed 3200MT/s
Bandwidth 819.2GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 819.2GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 300W	TDP 200W
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x32 63GB/sBandwidth

PCIe PCIe 4.0 x128 252GB/sBandwidth

iGPU

iGPU 60-Core M3 Ultra	iGPU -
Shaders 7680	Shaders -
Boost Clock 1.38GHz	Boost Clock -
Peak·FP32·FP16 21.2 TFLOPSFP16	Peak·FP32·FP16 -

NPU

NPU Model H15 Erebus	NPU Model -
NPU Cores 32	NPU Cores -
NPU Clock 2.36GHz	NPU Clock -
Performance 36 TOPSFP16	Performance -

Chip

Manufacturer Apple	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture Apple Silicon 13ARMv8.6-A	Architecture Zen 2
Family M Series	Family EPYC 7002
Branding	Branding
Codename Palma-D - M3 UltraVariant EverestP-Core Sawtooth E-Core	Codename Rome Aspen HighlandsDie Rome 8CCDVariant - -
Market Segment Workstation	Market Segment Server
Release Date Mar 5, 2025	Release Date Aug 7, 2019

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries GlobalFoundriesIO
Fabrication Node N3B -	Fabrication Node N7 12LPIO
Die Size 954mm² -	Die Size 592mm² 416mm²IO
Transistor Count 184 Billion -	Transistor Count 30.4 Billion 8.3 BillionIO
Transistor Density 193 MTr/mm² -	Transistor Density 51 MTr/mm² 20 MTr/mm²IO

Images

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Used In

Desktops Mac Studio(M3 Ultra, Early 2025)

Desktops Tinybox Red(Mid 2024)Tinybox Green(Mid 2024)

Competitors

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