CPUs

Apple M4 (10C10G) vs IBM PowerPC 750 233MHz Full Specs

10 Cores(4P+6E)
10 Threads(4P+6E)
4.51GHz
1 Cores
1 Threads
233MHz
TDP
30W
TDP
6W
Bandwidth
120GB/s
LPDDR5X
Bandwidth
-
iGPU
iGPU
-
··
4.04 TFLOPSFP16
··
-
Socket
-
Socket

10 Cores
4P
6E
1 Cores
1P
-
10 Threads
4P
6E
1 Threads
1P
-

Base Clock
4.51GHz
Base Clock
233MHz
Overclocking
Locked
Overclocking
Locked

L1i
192KB P
128KB E
L1i
32KB P
-
L1d
128KB P
64KB E
L1d
32KB P
-
L2
16MB P shared
4MB E shared
L2
512KB P
-
-
SLC Cache
8MB
SLC Cache
-

Type
LPDDR5X
Type
-
Max Memory
32GB
Max Memory
-
ECC
No
ECC
-
Channels
2
Channels
-
Bus Width
128-bit
Bus Width
-
Speed
7500MT/s
Speed
-
Bandwidth
120GB/s
Bandwidth
-
Bandwidth Calculator
Channels
Transfer Rate
··
120GB/s
Bandwidth Calculator
-

TDP
30W
TDP
6W
Max Operating Temp
100°C Max
Max Operating Temp
-

Bus Type
-
Bus Type
FSB
Bus Config
-
Bus Config
64-bit
Bus Speed
-
Bus Speed
66MT/s
Bus Bandwidth
-
Bus Bandwidth
0.5GB/s

PCIe
PCIe 4.0 x5
9.8GB/sBandwidth
-

iGPU
iGPU
-
Shaders
1280
Shaders
-
Boost Clock
1.58GHz
Boost Clock
-
··
4.04 TFLOPSFP16
··
-

NPU Model
H16 Leto
NPU Model
-
NPU Cores
16
NPU Cores
-
NPU Clock
2.36GHz
NPU Clock
-
Performance
38 TOPSINT8
Performance
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
PowerPC
Architecture
Architecture
Family
Family
Branding
M4  branding
Branding
PowerPC  branding
Codename
Donan
M4Variant
AS14PP-Core
AS14EE-Core
Codename
Arthur
-
-
-
Market Segment
Laptop
Market Segment
Desktop
Release Date
Oct 28, 2024
Release Date
Jan 1, 1997

Foundry
TSMC
Foundry
IBM
Fabrication Node
N3E
Fabrication Node
250nm
Die Size
169mm²
Die Size
67mm²
Transistor Count
28 Billion
Transistor Count
6 Million
Transistor Density
165 MTr/mm²
Transistor Density
-