Apple M4 Max (16C40G) vs Intel Core Ultra 9 275HX Full Specs

Summary

16 Cores(12P+4E) 16 Threads(12P+4E) 4.51GHz	24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz
TDP 140W	TDP 55W
Bandwidth 546.1GB/s LPDDR5X	Bandwidth 102.4GB/s DDR5
iGPU 40-Core M4 Max	iGPU Graphics 4C 1900MHz
Peak·FP32·FP16 16.16 TFLOPSFP16	Peak·FP32·FP16 3.89 TFLOPSFP16
Socket -	Socket BGA 2114

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M4 Max (16C40G)4,060

x1.33

Core Ultra 9 275HX3,044

x1

Show Top Score

Core Config

16 Cores 12P 4E	24 Cores 8P 16E
16 Threads 12P 4E	24 Threads 8P 16E

Clocks

Base Clock 4.51GHz	Base Clock 2.7GHz
Boost Clock -	Boost Clock 5.4GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 192KB P 128KB E	L1i 64KB P 64KB E
L1d 128KB P 64KB E	L1d 48KB P 32KB E
L2 32MB P shared 4MB E shared	L2 3MB P - 16MB E shared
L3 -	L3 24MB
SLC Cache 48MB	SLC Cache -

Memory

Type LPDDR5X	Type DDR5
Max Memory 128GB	Max Memory 192GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 512-bit	Bus Width 128-bit
Speed 8533MT/s	Speed 6400MT/s
Bandwidth 546.1GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 546.1GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 140W	TDP 55W
cTDP-down -	cTDP-down 45W
Peak Power -	Peak Power 160W
Max Operating Temp 100°C Max	Max Operating Temp 105°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x20 78.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 40-Core M4 Max	iGPU Graphics 4C 1900MHz
Shaders 5120	Shaders 512
Boost Clock 1.58GHz	Boost Clock 1.9GHz
Peak·FP32·FP16 16.16 TFLOPSFP16	Peak·FP32·FP16 3.89 TFLOPSFP16

NPU

NPU Model H16 Aether	NPU Model AI Boost 3
NPU Cores 16	NPU Cores 2
NPU Clock 2.36GHz	NPU Clock -
Performance 38 TOPSINT8	Performance 13 TOPSINT8

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 14ARMv9.2-A	Architecture Arrow Lake
Family M Series	Family Core Ultra Series 2
Branding	Branding
Codename Brava M4 MaxVariant AS14PP-Core AS14EE-Core	Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core
Market Segment Desktop	Market Segment Laptop
Release Date Oct 30, 2024	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCiGPU TSMCIO TSMCSoC
Fabrication Node N3E - - -	Fabrication Node N3B N5iGPU N6IO N6SoC
Die Size 454mm² - - -	Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC
Transistor Count 76 Billion	Transistor Count -
Transistor Density 167 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Laptops MacBook Pro 16(M4 Max, Late 2024)MacBook Pro 14(M4 Max, Late 2024)	Laptops Blade 18(Early 2025)
Desktops Mac Studio(M4 Max, Early 2025)	Desktops -

Competitors

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