CPUs

Google Tensor G2 vs Qualcomm Snapdragon 685 Full Specs

8 Cores(2P+2M+4E)
8 Threads(2P+2M+4E)
2.85GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.8GHz
TDP
10W
TDP
5W
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
1.52 TFLOPSFP16
··
486.4 GFLOPSFP16

8 Cores
2P
2M
4E
8 Cores
4P
-
4E
8 Threads
2P
2M
4E
8 Threads
4P
-
4E

Base Clock
2.85GHz
Base Clock
2.8GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
16KB E
L1i
32KB P
-
32KB E
L1d
64KB P
64KB M
16KB E
L1d
32KB P
-
32KB E
L2
1MB P
256KB M
128KB E
-
-
L2
2MB P shared
1MB E shared
L3
4MB
L3
-
SLC Cache
8MB
SLC Cache
-

Type
LPDDR5
Type
LPDDR4X
Max Memory
12GB
Max Memory
8GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
6400MT/s
Speed
4266MT/s
Bandwidth
51.2GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
17.1GB/s

TDP
10W
TDP
5W

iGPU
iGPU
Shaders
448
Shaders
128
Boost Clock
850MHz
Boost Clock
950MHz
··
1.52 TFLOPSFP16
··
486.4 GFLOPSFP16

NPU Model
Edge TPU Gen 2 (Janeiro)
NPU Model
Hexagon 686
NPU Cores
16
NPU Cores
-
NPU Clock
1.07GHz
NPU Clock
-
Performance
6.4 TOPS
Performance
3.3 TOPS

Modem Model
-
Modem Model
X11
Peak Down
-
Peak Down
Up to 390Mbps
Peak Up
-
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 265ARMv8.0-A
Family
-
Family
Branding
Tensor G2  branding
Branding
Snapdragon  branding
Codename
Cortex-X1P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Codename
Cortex-A73P-Core
-
Cortex-A53E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 6, 2022
Release Date
Mar 1, 2023

Foundry
-
Foundry
TSMC
Fabrication Node
-
Fabrication Node
N6

Smartphones
Smartphones
-