HiSilicon K3V2E vs UNISOC SC5735 Full Specs

Summary

4 Cores 4 Threads 1.5GHz	4 Cores 4 Threads 1.2GHz
TDP 5W	TDP 5W
Bandwidth 6.4GB/s LPDDR2	Bandwidth 6.4GB/s DDR3·LPDDR2
iGPU Vivante GC4000	iGPU Mali-400 MP4 400MHz
Peak·FP32·FP16 7.68 GFLOPSFP16	Peak·FP32·FP16 12.8 GFLOPSFP32

Core Config

4 Cores	4 Cores
4 Threads	4 Threads

Clocks

Base Clock 1.5GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB	L1i 32KB
L1d 16KB	L1d 32KB
L2 1MB shared	L2 512KB

Memory

Type LPDDR2	Type DDR3·LPDDR2
ECC No	ECC No
Channels 2	Channels 2
Bus Width 64-bit	Bus Width 32-bit
Speed 800MT/s	Speed 1600MT/s
Bandwidth 6.4GB/s	Bandwidth 6.4GB/s
Bandwidth Calculator Channels Transfer Rate800MT/s UC·Spec·OC 6.4GB/s	Bandwidth Calculator Channels Transfer Rate1600MT/s UC·Spec·OC 6.4GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Vivante GC4000	iGPU Mali-400 MP4 400MHz
Shaders 8	Shaders 16
Boost Clock 240MHz	Boost Clock 400MHz
Peak·FP32·FP16 7.68 GFLOPSFP16	Peak·FP32·FP16 12.8 GFLOPSFP32

Cellular

Modem Model -	Modem Model UNISOC HSPA
Peak Down -	Peak Down Up to 7.2Mbps
Peak Up -	Peak Up Up to 5.8Mbps

Chip

Manufacturer HiSilicon	Manufacturer UNISOC
ISA AArch32	ISA AArch32
Architecture ARMv7-A	Architecture ARMv7-A
Branding	Branding
Codename Cortex-A9P-Core	Codename Cortex-A7P-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jan 1, 2013	Release Date Jan 1, 2014

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 45nm	Fabrication Node 45nm

Images

Competitors

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