CPUs

HiSilicon Kirin 710A vs Qualcomm Snapdragon 835+ Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.6GHz
TDP
5W
TDP
5W
Bandwidth
9.6GB/s
·
Bandwidth
29.9GB/s
LPDDR4X
iGPU
iGPU
··
192 GFLOPSFP16
··
727 GFLOPSFP16

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
2GHz
Base Clock
2.6GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
32KB P
32KB E
L1d
32KB P
16KB E
L1d
32KB P
32KB E
L2
256KB P
128KB E
-
-
L2
2MB P shared
1MB E shared

Type
·
Type
LPDDR4X
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
1
Channels
2
Bus Width
32-bit
Bus Width
64-bit
Speed
2400MT/s
Speed
3733MT/s
Bandwidth
9.6GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
9.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
29.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
48
Shaders
256
Boost Clock
1GHz
Boost Clock
710MHz
··
192 GFLOPSFP16
··
727 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon 682

Modem Model
Balong 750
Modem Model
X16
Peak Down
Up to 600Mbps
Peak Down
Up to 1.0Gbps
Peak Up
Up to 150Mbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 280ARMv8.0-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 8 Series  branding
Codename
Cortex-A73P-Core
Cortex-A53E-Core
Codename
Cortex-A73P-Core
Cortex-A72E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Aug 1, 2018
Release Date
Nov 23, 2018

Foundry
-
Foundry
Samsung
Fabrication Node
-
Fabrication Node
10LPE