CPUs

HiSilicon Kirin 820 5G vs Qualcomm Snapdragon 768G Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.36GHz
8 Cores(1P+1M+6E)
8 Threads(1P+1M+6E)
2.8GHz
TDP
5W
TDP
5W
Bandwidth
34.1GB/s
LPDDR4X
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
629.8 GFLOPSFP16
··
1.15 TFLOPSFP16

8 Cores
1P
3M
4E
8 Cores
1P
1M
6E
8 Threads
1P
3M
4E
8 Threads
1P
1M
6E

Base Clock
2.36GHz
Base Clock
2.8GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
256KB M
128KB E
L2
512KB P
256KB M
128KB E
SLC Cache
-
SLC Cache
1MB

Type
LPDDR4X
Type
LPDDR4X
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
4266MT/s
Speed
4266MT/s
Bandwidth
34.1GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
17.1GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
192
Shaders
384
Boost Clock
820MHz
Boost Clock
750MHz
··
629.8 GFLOPSFP16
··
1.15 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon 696
Performance
-
Performance
5.4 TOPS

Modem Model
Balong 5000
Modem Model
X52
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 4.6Gbps
Peak Down
Up to 3.7Gbps
Peak Up
Up to 2.5Gbps
Peak Up
Up to 1.6Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 475ARMv8.2-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon  branding
Codename
Cortex-A76P-Core
Cortex-A76M-Core
Cortex-A55E-Core
Codename
Cortex-A76P-Core
Cortex-A76M-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Feb 1, 2020
Release Date
May 11, 2020

Foundry
-
Foundry
Samsung
Fabrication Node
-
Fabrication Node
7LPP