CPUs

HiSilicon Kirin 9010 vs Qualcomm Snapdragon 4 Gen 1 Full Specs

8 Cores(1P+3M+4E)
12 Threads(2P+6M+4E)
2.3GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2GHz
TDP
5W
TDP
5W
Bandwidth
67.2GB/s
LPDDR5X
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
3.07 TFLOPSFP16
··
972.8 GFLOPSFP16

Kirin 9010Kirin 90101,421
x1
Snapdragon 4 Gen 1Snapdragon 4 Gen 1-
-

8 Cores
1P
3M
4E
8 Cores
2P
-
6E
12 Threads
2P
6M
4E
8 Threads
2P
-
6E

Base Clock
2.3GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L2
512KB P
256KB M
128KB E
L2
512KB P
-
128KB E

Type
LPDDR5X
Type
LPDDR4X
Max Memory
16GB
Max Memory
8GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
8400MT/s
Speed
4266MT/s
Bandwidth
67.2GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
67.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
17.1GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
1024
Shaders
256
Boost Clock
750MHz
Boost Clock
950MHz
··
3.07 TFLOPSFP16
··
972.8 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon

Modem Model
Balong 5000
Modem Model
X51
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 4.6Gbps
Peak Down
Up to 2.5Gbps
Peak Up
Up to 2.5Gbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
TaishanARMv8.2-A
Architecture
KryoARMv8.2-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 4 Gen 1  branding
Codename
Taishan V121P-Core
Taishan V121M-Core
Cortex-A510E-Core
Codename
Cortex-A78P-Core
-
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Apr 1, 2024
Release Date
Oct 6, 2022

Foundry
SMIC
Foundry
TSMC
Fabrication Node
N+2
Fabrication Node
N6

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