HiSilicon Kirin 9010 vs Qualcomm Snapdragon 6s Gen 3 Full Specs
8 Cores(1P+3M+4E) 12 Threads(2P+6M+4E) 2.3GHz | 8 Cores(2P+6E) 8 Threads(2P+6E) 2.3GHz |
TDP 5W | TDP 5W |
Bandwidth 67.2GB/s LPDDR5X | Bandwidth 17.1GB/s LPDDR4X |
iGPU | iGPU |
·· 3.07 TFLOPSFP16 | ·· 972.8 GFLOPSFP16 |
Kirin 90101,421
Snapdragon 6s Gen 39408 Cores 1P 3M 4E | 8 Cores 2P - 6E |
12 Threads 2P 6M 4E | 8 Threads 2P - 6E |
Base Clock 2.3GHz | Base Clock 2.3GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P - 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P - 32KB E |
L2 512KB P 256KB M 128KB E | L2 512KB P - 128KB E |
Type LPDDR5X | Type LPDDR4X |
Max Memory 16GB | Max Memory 12GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 32-bit |
Speed 8400MT/s | Speed 4266MT/s |
Bandwidth 67.2GB/s | Bandwidth 17.1GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 17.1GB/s |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 1024 | Shaders 256 |
Boost Clock 750MHz | Boost Clock 950MHz |
·· 3.07 TFLOPSFP16 | ·· 972.8 GFLOPSFP16 |
NPU Model - | NPU Model Hexagon |
Modem Model Balong 5000 | Modem Model X62 |
Cellular 5G | Cellular 5G mmWave |
Peak Down Up to 4.6Gbps | Peak Down Up to 4.4Gbps |
Peak Up Up to 2.5Gbps | Peak Up Up to 1.6Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture TaishanARMv8.2-A | Architecture KryoARMv8.2-A |
Family - | Family |
Branding  | Branding  |
Codename Taishan V121P-Core Taishan V121M-Core Cortex-A510E-Core | Codename Cortex-A78P-Core - Cortex-A55E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Apr 1, 2024 | Release Date Jun 1, 2024 |
Foundry SMIC | Foundry TSMC |
Fabrication Node N+2 | Fabrication Node N6 |
No images available
No images available