CPUs

HiSilicon Kirin 955 vs Qualcomm Snapdragon 435 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.5GHz
8 Cores
8 Threads
1.4GHz
TDP
5W
TDP
5W
Bandwidth
19.2GB/s
·
Bandwidth
6.4GB/s
LPDDR3
iGPU
iGPU
··
72 GFLOPSFP32
··
86.4 GFLOPSFP16

8 Cores
4P
4E
8 Cores
8P
-
8 Threads
4P
4E
8 Threads
8P
-

Base Clock
2.5GHz
Base Clock
1.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
32KB P
-
L1d
32KB P
16KB E
L1d
32KB P
-
L2
256KB P
128KB E
-
L2
2MB P shared

Type
·
Type
LPDDR3
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
1
Bus Width
64-bit
Bus Width
32-bit
Speed
2400MT/s
Speed
1600MT/s
Bandwidth
19.2GB/s
Bandwidth
6.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
19.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
6.4GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
40
Shaders
48
Boost Clock
900MHz
Boost Clock
450MHz
··
72 GFLOPSFP32
··
86.4 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon 536

Modem Model
Balong 720
Modem Model
X9
Peak Down
Up to 300Mbps
Peak Down
Up to 300Mbps
Peak Up
Up to 50Mbps
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon  branding
Codename
Cortex-A72P-Core
Cortex-A53E-Core
Codename
Cortex-A53P-Core
-
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
May 1, 2016
Release Date
Oct 12, 2016

Foundry
Samsung
Foundry
Samsung
Fabrication Node
28nm LP
Fabrication Node
28nm LP